Global OIP Ecosystem Events

Join Us to Connect, Collaborate,
and Shape the Future of AI

Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform^® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss turning visionary ideas into reality.

As the AI revolution expands rapidly from hyperscale data centers to the edge, the industry demands unprecedented performance, power efficiency, and integration. The TSMC 2026 Technology Symposium through its theme of “Expanding AI with Leadership Silicon” showcased the foundational technologies that deliver to these needs. Heightened collaboration across the entire ecosystem is equally fundamental to meet the broadened scope and accelerated pace of development for the AI era. So, it is only apt that our global OIP events are anchored around the complementary theme of “Expanding AI with Leadership Ecosystem.”

6 Regions 225⁺ Technical Talks 6000⁺ Attendance 750⁺ Companies

Expanding AI with Leadership Ecosystem

Next-generation AI workloads are built on a foundation of advanced silicon and packaging technologies. Through a series of curated technical presentations at the forum, you will discover how TSMC is pushing the boundaries of scaling, power delivery, and system integration. We will showcase TSMC’s latest advancements in leading-edge process technologies alongside groundbreaking developments in TSMC 3DFabric^® advanced 3D stacking and packaging and TSMC-COUPE™, the innovative co-packaged optics solution.

Under the banner of our Leadership Ecosystem, this year’s forum also shines a spotlight on how the collaboration between TSMC and its OIP partners is harnessing the immense potential of AI to supercharge next-generation design solutions. From AI-driven EDA tools and agentic AI flows, robust IP portfolios, secure cloud environments to expert design services, our collaborative ecosystem is actively streamlining design complexity, mitigating multiphysics challenges, and accelerating your time-to-market.

Whether you join us in person at our regional events across North America, Japan, Taiwan, China, and Europe, or connect with us online, this is your premier opportunity to network with the silicon architects of tomorrow.

Don’t miss your chance to collaborate with the leaders of semiconductor technology and help expand AI, today!

What You Will Discover:

Next-Gen Silicon Leadership: Explore the cutting-edge design flows, methodologies, and solutions required to tackle energy efficiency, multiphysics effects, and the most advanced design architectures using TSMC’s pioneering A14, TSMC A16™, and N2 processes.
Continuous Design Enablement: Gain firsthand updates on the steady progress of tools and solutions optimized for TSMC’s advanced nodes, including N3, N2 and beyond processes.
Advanced 3D Stacking and Packaging Breakthroughs: Learn about the newest advancements in design solutions for TSMC 3DFabric^®—including InFO, CoWoS^®, TSMC-SoIC^®, and TSMC-SoW™—and TSMC-COUPE™.
Agentic AI Productivity: Discover how autonomous, agentic AI design workflows are being deployed by our ecosystem partners to dramatically boost productivity and optimize both 2D and 3D IC designs.
Targeted Application Solutions: Dive into specialized design enablement technologies, IPs, and architectures tailored for HPC, AI/ML, automotive, mobile, and IoT applications.
Specialty Technology Innovation: Access comprehensive design enablement for specialty platforms, covering ultra-low power, ultra-low voltage, analog, RF, and mmWave technologies.
Proven Real-World Customer Success: Learn from successful, real-life case studies showcasing customer collaboration with TSMC OIP partners to leverage advanced design technologies, IP solutions, and cloud-based design environments and significantly accelerate time-to-market.