Maintaining dependable capacity is a key part of TSMC's manufacturing strategy. The Company currently operates three 12-inch GIGAFAB® facilities – Fabs 12, 14 and 15. The combined capacity of the three facilities exceeded 8 million 12-inch wafers in 2018. Production within these three facilities supports 0.13µm, 90nm, 65nm, 40nm, 28nm, 20nm, 16nm, 10nm, and 7nm process technologies, including each technology's sub-nodes. An additional portion of the capacity is reserved for R&D work on leading-edge manufacturing technologies, which currently supports the technology development of the 5nm, 3nm node and beyond.
The three GIGAFAB® facilities are coordinated by the centralized fab manufacturing management system known as super manufacturing platform (SMP) to provide customers with greater benefits in the form of more consistent quality and reliability, improved flexibility to cope with demand fluctuations, faster yield learning and time-to-volume, and lower-cost product requalification.
|Profile||Monthly 300mm capacity (pcs)||~10K||~25K||>100K|
|Customer Values||Operating cost||High||Medium||Low|