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Maintaining dependable capacity is a key part of TSMC's manufacturing strategy. The Company currently operates three 12-inch GIGAFAB® facilities – Fabs 12, 14 and 15. The combined capacity of the three facilities exceeded 7 million 12-inch wafers in 2017. Production within these three facilities supports 0.13μm, 90nm, 65nm, 40nm, 28nm, 20nm, 16nm, 10nm, and 7nm process technologies, including each technology's sub-nodes. An additional portion of the capacity is reserved for R&D work on leading-edge manufacturing technologies, which currently supports the technology development of the 5nm node and beyond.

TSMC has developed a centralized fab manufacturing management system, Super Manufacturing Platform (SMP), to provide customers with greater benefits in the form of more consistent quality and reliability, improved flexibility to cope with demand fluctuations, faster yield learning and time-to-volume, and lower-cost product requalification.

  Mini Mega Giga
Profile Monthly 300mm capacity (pcs) ~10K ~25K >100K
Customer Values Operating cost High Medium Low
Flexibility Limited Medium High
Ramp-up agility Limited Medium High
Cycle time Long Medium Short
Delivery precision Limited Medium High
TSMC May 2019 Revenue Report(2019/06/10)
TSMC Research Highlighted at 2019 Symposia on VLSI Technology & Circuits(2019/06/06)
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