As advanced technology continues to evolve and the geometry keeps shrinking, the need for tighter process control and quality requirement has become extremely challenging for manufacturing. TSMC's unique manufacturing infrastructure is tailored to handle a diversified product portfolio, which uses strict process control to attain tightened specs and meet higher product quality, performance, and reliability requirements. To achieve overall optimization of quality, yield, process and equipment, the process control and analysis systems have been integrated with many intelligent functions to perform self-diagnosis, self-learning and self-reaction. These, in turn, have demonstrated remarkable results in yield enhancement, quality assurance, workflow improvement, fault detection, cost reduction and shortening of the R&D cycle.
TSMC has developed systems for precise fault detection and classification, intelligent advanced equipment control and intelligent advanced process control to monitor the manufacturing process in a timely manner and adjust conditions precisely. To achieve quality-first and ensure highly efficient and effective production, the Company has created precision equipment matching and yield mining to minimize process variation and potential defect and excursion.
To meet the stricter quality requirements of mobile, high performance computing, automotive and the Internet of Things, TSMC has further developed Big Data, Machine Learning, and Artificial Intelligence architecture, which identify critical variables to strengthen process control, optimize quality, and improve yield management and operating efficiency simultaneously.