TSMC introduces the new 3DFabric Alliance, a significant addition to TSMC’s Open Innovation Platform® (OIP), to help customers overcome the rising challenges of semiconductor and system-level design complexity and achieve speedy implementation of innovations for next-generation HPC and mobile applications using TSMC’s 3DFabric™ technologies.

The 3DFabric Alliance is the first of its kind in the semiconductor industry and aims to achieve the following goals with the collaborative efforts of our OIP ecosystem partners:

  1. Accelerate 3DFabric ecosystem innovation and readiness
  2. Speed up 3DFabric customer adoption and production
  3. Lead industry in system design by integrating advanced logic with 3DFabric technologies to provide a full spectrum of best-in-class solutions and services for semiconductor design, memory modules, substrate technology, testing, manufacturing, and packaging.

Semiconductors have established their place as a truly essential technology. Their importance will increase across all industries, driven by increasing silicon content in everything from automotive and data centers to IoT, smartphones, and HPC-related applications. These modern workloads have brought packaging technologies to the forefront of innovation as they are critical to a product’s performance, function, and cost. Therefore, product design must embrace a more holistic approach for optimization at the system level.

3D silicon stacking and advanced packaging technologies open the door to a new era of chip-level and system-level innovation, but they require extensive ecosystem collaboration to help designers navigate the best path through the myriad options and approaches available to them. That’s why TSMC has launched the 3DFabric Alliance, in addition to the existing OIP ecosystem partnership in EDA, IP, DCA, Cloud and VCA, which offers customers an easy and flexible way to unlocking the power of 3D IC in their designs using TSMC’s 3DFabric technologies, a comprehensive family of 3D silicon stacking and advanced packaging technologies.

Through the 3DFabric Alliance, TSMC works with alliance members in the following seven areas to deliver a full spectrum of highest-quality, readily-available solutions and services to meet customer’s 3D IC design needs in all relevant design stages of EDA tools and flows, IPs and memory components, design services, as well as backend processes including OSAT, substrate, and testing to enable customers’ delivery of quality system products.

3DFabric Alliance

TSMC 3DFabric™ Alliance Members
EDA Ansys, Cadence, Keysight, Siemens EDA, and Synopsys
IP Alphawave, ARM, Cadence, proteanTecs, Silicon Creations, and Synopsys
DCA/VCA Alchip and Global Unichip Corp (GUC)
Memory Micron, Samsung Memory, and SK hynix
OSAT Amkor, Advanced Semiconductor Engineering (ASE) Group, Siliconware Precision Industries Ltd (SPIL), and STATSChipPAC
Substrate IBIDEN, Toppan, and Unimicron Technology Corp (UMTC)
Testing Advantest, Cadence, Keysight, proteanTecs, Siemens EDA, Synopsys and Teradyne

More details of TSMC 3DFabric™