Executives

Education:
  • Ph.D., Electrical Engineering and Computer Science, University of California, Berkeley, USA
Experience:
  • President and Co-Chief Executive Officer, TSMC
  • Senior Vice President, Operations, TSMC
  • Senior Vice President, Advanced Technology Business, TSMC
  • Vice President, South-Site Operation, TSMC
  • President, Worldwide Semiconductor Manufacturing Corp.

Dr. Mark Liu is Chairman of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to assuming this post, he was President and Co-CEO of TSMC from 2013 to 2018, where he oversaw TSMC's leading-edge technology development, and was Co-Chief Operating Officer from 2012 to 2013. Before that, he served in a number of executive positions at TSMC, including Senior Vice President of the Advanced Technology Business and Senior Vice President of Operations. Dr. Liu established TSMC's first 12-inch fab, and later TSMC's GIGAFAB® operations. He also served as President of Worldwide Semiconductor Manufacturing Corp prior to its merger with TSMC. Dr. Liu joined TSMC in 1993 as an engineering deputy director and established TSMC's first 8-inch fab.

Before joining TSMC, Dr. Liu was with AT&T Bell Laboratory in Holmdel, NJ, from 1987 to 1993 as a research manager for the High Speed Electronics Research Laboratory, working on optical fiber communication systems. From 1983 to 1987, he was a process integration manager at Intel Corporation, Santa Clara, CA, developing technologies for Intel microprocessors.

Dr. Liu is also Chairman of the Taiwan Semiconductor Industry Association (TSIA). In addition, he serves on the Presidential CEO Advisory Board of the Massachusetts Institute of Technology, and on the Engineering Advisory Board of the UC Berkeley College of Engineering.

Dr. Mark Liu received B.S. degree in electrical engineering from National Taiwan University. He received M.S. and Ph.D. degrees in electrical engineering and computer science from University of California, Berkeley.

Education:
  • Ph.D., Electrical Engineering, Yale University, USA
Experience:
  • President and Co-Chief Executive Officer, TSMC
  • Executive Vice President and Co-Chief Operating Officer, TSMC
  • Senior Vice President, Business Development, TSMC
  • Senior Vice President, Mainstream Technology Business, TSMC
  • Vice President, South Site Operation, TSMC
  • Senior Vice President, Technology, Chartered Semiconductor Manufacturing Ltd.

Dr. C. C. Wei is Chief Executive Officer of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to this appointment, Dr. Wei was TSMC's President and Co-CEO from November 2013 to June 2018 and Co-Chief Operating Officer from March 2012 to November 2013. From 2009 to 2012, he was TSMC's Senior Vice President of Business Development. Before that, Dr. Wei was Senior Vice President of Mainstream Technology Business.

Before joining TSMC in 1998, Dr. Wei had served as Senior Vice President of Technology at Chartered Semiconductor and Senior Manager, Logic and SRAM technology development at ST Microelectronics. Prior to that, he was a Member of Technical Staff at Texas Instruments R&D organization.

C. C. Wei received his B.S. degree in electrical engineering from National Chiao Tung University and Ph.D. from Yale University.

Education:
  • EMBA, National Taiwan University, Taiwan
Experience:
  • Senior Vice President, Chief Financial Officer and Spokesperson, TSMC
  • Vice President and Chief Financial Officer, TI-Acer Semiconductor Manufacturing Corp.

Lora Ho is the Senior Vice President of Europe and Asia Sales for Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for supporting the needs of customers in regions including EMEA, Korea, India, China, Japan, and Taiwan.

Ms. Ho joined TSMC in 1999 and worked as Corporate Controller before serving as Chief Financial Officer and Spokesperson from 2003 to 2019. Prior to TSMC, Ms. Ho was employed in various accounting and finance positions at multinational companies in Taiwan.

Ms. Ho was awarded "Outstanding Financial Executive" for the year for 1993 by the Financial Executives Institute, the "Best Companies' Best CFO" of Taiwan from 2007-2010 by FinanceAsia, as well as the “Best CFO in Asia” in 2011 by Institutional Investor magazine. She was also named as one of “Nine of the Most Influential Women in Asian Tech” by Nikkei Asian Review magazine in 2018.

Ms. Ho received her MBA degree from National Taiwan University and a B.A. degree from National Cheng-chi University.

Education:
  • Ph.D., Solid State Physics and Surface Chemistry, University of California, Berkeley, USA
Experience:
  • Vice President, Operations for Manufacturing Technology, TSMC
  • Vice President, Advanced Technology Business, TSMC
  • Vice President, Research & Development, TSMC
  • Vice President, Operation II, TSMC
  • Director, Advanced Technology Development & CTM Plant Manager, Intel

Dr. Wei-jen Lo is Senior Vice President of Technology Development under Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Dr. Lo joined TSMC in 2004 as Vice President of Operations II and served as Vice President of Research and Development from 2006 to 2009 before he was appointed Vice President of the Company's Advanced Technology Business, and Operations for Manufacturing Technology.

In his over 15 years of services at TSMC, Dr. Lo has contributed greatly to the company's development of advanced technologies, providing comprehensive and innovative solutions to customers' tough technical challenges. Currently he leads a team that has earned a total of more than 1,500 patents globally, including around 1,000 US patents.

Prior to joining TSMC, Dr. Lo was Director of Technology Development and a Plant Manager with Intel Corporation's Technology and Manufacturing Group. From 1997 to 2000, he served as a Factory Manager, responsible for running Intel's development factory in Santa Clara, California. Dr. Lo has also served as an assistant professor at a U.S. university, and worked at the Motorola Research and Development Lab, as well as the Xerox Microelectronics Center.

Dr. Lo received his B.S. degree in physics from National Taiwan University and his M.S. and Ph.D. degrees in Solid State Physics and Surface Chemistry from University of California, Berkeley.

Education:
  • B.S. degree in Engineering, United States Military Academy at West Point, USA
Experience:
  • Senior Vice President, Chief Executive Officer of TSMC North America
  • Vice President, TSMC North America Account Management
  • General Manager, Military & Aerospace Division and Co-Chair of General Manager Council, National Semiconductor.

Mr. Rick Cassidy is Senior Vice President responsible for the Corporate Strategy Office of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He joined TSMC North America in 1997 as Vice President of Account Management and was promoted to President and CEO of TSMC North America in 2005. In 2008, Mr. Cassidy was appointed Corporate Vice President of TSMC, responsible for the North American region, and promoted to Senior Vice President in 2014. In more than two decades of service at TSMC, Mr. Cassidy has contributed greatly to the success of the fabless semiconductor business model with his dedication to customer trust while bringing record growth to the Company.

Mr. Cassidy's electronics career began at Fairchild Semiconductor, later acquired by National Semiconductor. Over an 18-year span he rose through manufacturing, engineering, quality and reliability, and marketing, culminating with his appointment as Vice President and General Manager of National's Military & Aerospace Division and Co-Chair of National's General Manager Council.

Prior to entering the semiconductor industry, Mr. Cassidy served as an officer in the U.S. Army. He holds a Bachelor of Science degree in Engineering from the United States Military Academy at West Point. Mr. Cassidy currently serves on the Global Semiconductor Alliance (GSA) Board of Directors, an organization dedicated to the advancement of the worldwide semiconductor industry.

Education:
  • M.S., Electrical Engineering, National Cheng-Kung University, Taiwan
Experience:
  • Vice President, Operations for Product Development, TSMC
  • Vice President, Advanced Technology Business, TSMC

Mr. Y.P. Chin is Senior Vice President of Product Development at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to his promotion to Senior Vice President in 2016, he served as Vice President of Operations for Product Development. Before assuming that post, he was Vice President of Advanced Technology Business in TSMC, sharing responsibility for TSMC's advanced technology and 300mm fab operations.

Mr. Chin joined TSMC when it was founded in 1987 and has made significant contribution to the Company's product engineering capabilities throughout his career. He was Director of Fab 1 from 1997 to 1998, and in later positions supported yield improvement in all new generations of advanced technology, including the 28nm, 16nm, and 7nm nodes. Mr. Chin also manages sub-nodes including N22 and N12, as well as development of specialty technologies such as radio frequency, high voltage, and image sensors. Mr. Chin pioneered the development of TSMC's Golden Spice Modeling methodology and Design for Manufacturing program.

Prior to joining TSMC, Mr. Chin served as an engineer with the Industrial Technology Research Institute's Electronics Research and Service Organization (ERSO-ITRI).

Mr. Chin earned his B.S. and M.S. degrees in Electrical Engineering from National Cheng Kung University.

Education:
  • Ph.D., Electrical Engineering, University of California, Los Angeles, USA
Experience:
  • Vice President, Research & Development, TSMC

Dr. Y.J. Mii is Senior Vice President of Technology Development under Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Dr. Mii joined TSMC in 1994 as a manager at Fab 3 and then joined the company's R&D organization in 2001. In 2011, Dr. Mii was appointed Vice President of Research and Development and later he was promoted to Senior Vice President in November 2016.

In more than two decades of services at TSMC, Dr. Mii has contributed greatly to the development and manufacturing of advanced CMOS technologies in both Fab Operations and R&D. He successfully managed the development of 90nm, 40nm and 28nm technologies. By spearheading the research and development of 16nm, 7nm, 5nm, and beyond, he has helped maintain TSMC's technology leadership in the foundry segment of the global semiconductor industry.

Dr. Mii received the National Manager Excellence Award in 2008, recognizing his innovative “half-node” concept for 40nm process technology that improved performance and reduced die size. He also received the National Engineering Excellence Award in 2004. Before joining TSMC, Dr. Mii was a research staff member at IBM Research Center.

Dr. Mii has 34 patents globally, including 25 US patents, and holds a B.S. in electrical engineering from National Taiwan University, as well as an M.S. and Ph.D. in Electrical Engineering from the University of California, Los Angeles (UCLA).

Education:
  • B.S. degree in Industrial Education & Technology, National Changhua University of Education
Experience:
  • Vice President, Mainstream Fabs and Manufacturing Technology Center, TSMC
  • Senior Director, Mainstream Fabs, TSMC
  • Senior Director, Advanced Technology Business, TSMC
  • Senior Director, Fab12 / Fab 6, TSMC

J.K. Lin is Senior Vice President of Information Technology and Materials Management & Risk Management at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Mr. Lin is actively driving information security and corporate digitalization, as well as applying artificial intelligence and machine learning towards smart manufacturing, R&D, and productivity improvement. He strongly believes in the importance of responsible procurement and is dedicated to creating a sustainable supply chain. Prior to assuming duties in his current function, Mr. Lin served as Vice President of Mainstream Fabs and the Manufacturing Technology Center.

Mr. Lin joined TSMC when it was founded in 1987 as one of the first group of employees transferred from Taiwan’s Industrial Technology Research Institute (ITRI). He began as an Equipment Engineer held and a number of manager positions in Fab 1 and 2. Mr. Lin was also responsible for the construction of Fab 3 and later served as Fab Director of Fab 3, Fab 4, Fab 7, as well as Senior Director of Fab 6, Fab 12, and Advanced Technology Fabs.

Mr. Lin led Fab 6 in its successful volume production of the then highly-advanced 130nm copper process in 2002. He later served as Senior Director of TSMC’s first 12-inch fab from 2003-2008, playing an important role in the smooth transition of the 130nm, 90/85nm, 65/55nm, and 40nm technology nodes to volume production on 12-inch wafers, and setting a solid foundation for the Company’s manufacturing excellence. Mr. Lin also laid the groundwork for automation and intelligent manufacturing in 12-inch fabs as well as production management for GigaFabs.

Mr. Lin also currently serves as an Executive Director on the Board of the Allied Association for Science Park Industries, and a Director on the Board of the Taiwan Electrical and Electronic Manufacturers’ Association.

Prior to joining TSMC, Mr. Lin worked in the Electronic Research & Service Organization (ERSO) of ITRI.

J.K. Lin received his B.S. degree from National Changhua University of Education.

Education:
  • M.S., Chemical Engineering, National Cheng-Kung University, Taiwan
Experience:
  • Vice President, 300mm Fabs Operations, TSMC
  • Senior Director, 300mm Fabs, TSMC
  • Senior Director, Mainstream Technology Business, TSMC
  • Senior Director, Fab14, TSMC

Mr. J. K. Wang is Senior Vice President of Fab Operations at Taiwan Semiconductor Co. Ltd. (TSMC), responsible for all 6”, 8” and 12” production fabs, new fab construction, facility, and several fab supporting functions. Prior to this post, he was the Vice President of 300mm Fabs Operations.

Mr. Wang has served at TSMC since the company was founded in 1987. During his career with TSMC, Mr. Wang has played a wide range of roles in the company's operations, including module engineering, process integration, technology development, new technology transfer, manufacturing management and fab management. Mr. Wang has been deeply involved in building up TSMC's manufacturing technology and systems to support the launching and mass production of advanced process technologies, as well as driving the transition from fab automation to Big Data and AI-empowered intelligent manufacturing. He is also dedicated to TSMC's green manufacturing, including green buildings, energy conservation, water recycling, waste reduction, circular economy and more to fulfill the Company's commitment to sustainable manufacturing.

Mr. Wang received his B.S. and M.S. degrees in chemical engineering from National Cheng-Kung University.

Education:
  • Ph.D., Electrical and Computer Engineering, Syracuse University, USA
Experience:
  • Senior Director, Design and Technology Platform, TSMC

Dr. Cliff Hou has served as Vice President of Technology Development under Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) since August 2018. Prior to this post, Dr. Hou was TSMC's Vice President of Design and Technology Platform from August 2011 to July 2018. He began his career at TSMC in 1997 and has since played a key role in the Company's design technology and ecosystem development.

From 1997 to 2007, Dr. Hou established the company's technology design kit and reference flow development organizations. Over the last decade, Dr. Hou supported the development of TSMC's Open Innovation Platform® (OIP), which is now the most comprehensive design ecosystem in the global semiconductor industry.

Dr. Hou received that National Manager Excellence Award in 2010 as a pioneer in reference flows and design for manufacturing (DFM) that significantly lowers IC design barriers. He led the Company's OIP project team to win the first National Industry Innovation Award in 2011, presented by the Taiwan Ministry of Economic Affairs (MOEA).

Prior to joining TSMC, Dr. Hou was a section manager specializing in design environment at the Computer & Communications Research Laboratories, Industrial Technology Research Institute (ITRI/CCL) in Taiwan. He also served as an Associate Professor at Kaohsiung Polytechnic Institute (now known as I-Shou University) in Taiwan.

Dr. Hou holds 44 U.S. Patents and serves as a member of Board of Directors in Global Unichip Corp. He received B.S. degree in Control Engineering from Taiwan's National Chiao-Tung University, and Ph.D. in Electrical and Computer Engineering from Syracuse University.

Education:
  • M.C.L., College of Law, University of Iowa, USA
Experience:
  • Chairman, Taiwan Association for Trade Secrets Protection (TTSP)
  • Associate General Counsel, TSMC
  • Director, Corporate Legal Division, TSMC
  • Senior Associate, Taiwan International Patent and Law Office (TIPLO)

Ms. Sylvia Fang has served as Vice President and General Counsel at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) since August, 2014. Previously, she had served as the Company's Associate General Counsel. Since Ms. Fang joined TSMC in 1995, she has worked on numerous high-profile corporate transactions, precedent-setting intellectual property and trade secret litigation, the promotion of significant legal changes, and the resolution of corporate governance issues. She has also worked extensively with the Board of Directors, including the independent directors, on various Board, Audit Committee and Compensation Committee matters, as well as extended projects.

Ms. Fang jointly founded the Taiwan Association for Trade Secrets Protection (TTSP) in 2015, and served as its Chairman for the first two terms to help promote legal reform of Taiwan's trade secret laws and regulations.

Prior to her career at TSMC, Ms. Fang worked at one of Taiwan's leading boutique intellectual property law firms, TIPLO, where she developed her expertise on general corporate and IP issues.

Ms. Fang's achievements are also widely recognized by the global legal community. In 2005, Asialaw magazine awarded her the “Deep & Far Award for Taiwan In-House Counsel”. She has also cultivated relationships with key government, trade, commerce and securities administrative agencies through her years of promoting important legal changes.

Ms. Fang is an attorney admitted in Taiwan having received her LL.B. degree from National Taiwan University, and her M.C.L. degree from College of Law, University of Iowa.

Education:
  • EMBA, International Business Management, National Taiwan University
Experience:
  • Director of Human Resources, TSMC
  • Senior Vice President, Global Human Resources, Trend Micro Inc.

Ms. Connie Ma is vice president of human resources at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). She joined TSMC in June 2014 as Director of Human Resources and was appointed to the current post two months later.

Ms. Ma has over 30 years of HR experience. Prior to joining TSMC, she held several senior HR managerial positions at Trend Micro Inc., NCR Corporation and Primax Electronics Ltd. In 2002, Ms. Ma began leading Trend Micro’s HR team in Asia, and later she was promoted to Senior Vice President of Global Human Resources at Trend Micro where Ms. Ma helped building a global HR team to enhance the execution of corporate strategy and culture in terms of realigning organization structure, strengthening global collaboration and facilitating employee engagement. Before joining Trend Micro, Ms. Ma was a Greater China HR director at NCR Corporation and served as HR Vice President at Primax. Ms. Ma received the Manager Innovation Award of Taiwan’s National HRD InnoPrize in 2007.

Ms. Ma holds an EMBA from National Taiwan University and a bachelor's degree in business administration from Soochow University.

Education:
  • Ph.D., Electrical Engineering, National Chiao Tung University
Experience:
  • Senior Director, Fab 14B, TSMC
  • Vice President, RD/Technology Development, TSMC

Dr. Y.L. Wang is Vice President of Fab Operations at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He joined TSMC in 1992, progressively gaining responsibility in various production management roles at TSMC's fabs during his early tenure, and was appointed TSMC's Vice President of Technology Development in October 2015 prior to the current post.

In his more than 20 years of services at TSMC, Dr. Wang has successfully contributed to mass production of the company's 0.35-micron, 0.25-micron, 0.18-micron, 0.13-micron, 90nm, 65nm, 40nm, 20nm and 16nm process technologies, significantly improving productivity and enhancing defect density. He also joined development of more advanced 10nm, 7nm, and 5nm technologies, and successfully transferred these technologies into fab production.

With a Strong track record of patents, Dr. Wang was awarded as an excellent engineer by the Chinese Institute of Engineers, and received the National Invention Award five times between 2005 and 2011. Currently he has 283 patents globally including 136 U.S. patents.

Dr. Wang received his B.S. degree in Physics from National Tsing Hua University; his M.S. degree in Materials Science from National Sun Yat-Sen University, and Ph.D. in Electrical Engineering and Computer Science from National Chiao Tung University.

Education:
  • Ph.D., Materials Engineering, Georgia Institute of Technology, USA
Experience:
  • Senior Director, Integrated Interconnect & Packaging Division in R&D, TSMC

Dr. Douglas Yu is Vice President of Integrated Interconnect & Packaging under Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for research and development of advanced packaging and system integration solutions. Prior to his appointment to Vice President in 2016, Dr. Yu was Senior Director of the Integrated Interconnect & Packaging Division.

Dr. Yu joined TSMC in 1994, serving in a variety of roles throughout his career including backend R&D, and developed technologies critical to the Company’s highly successful transition to copper process at the 0.13 micron generation. Dr. Yu also pioneered TSMC’s wafer-level system integration technologies, including Chip on Wafer on Substrate (CoWoS®), Integrated Fan-Out (InFO), and TSMC System on Integrated Chips (SoIC™), as well as their derivatives.

Prior to joining TSMC, Dr. Yu was a Member of Technical Staff and Project Leader at AT&T Bell Labs in USA, working on sub-micron process, device and integration technologies R&D from 1987 to 1994.

Dr. Yu became a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013, and received the Presidential Science Prize of Taiwan in 2017 as well as the IEEE EPS Outstanding Manufacturing Technology Award in 2018. He has received more than 1,800 worldwide patents while serving at TSMC.

Dr. Yu received his B.S. degree in Physics and M.S. degree in Materials Science and Engineering both from National Tsing Hua University, and Ph.D. in Materials Engineering from Georgia Institute of Technology.

Education:
  • Ph.D., Electrical Engineering, Carleton University, Canada
Experience:
  • Senior Director of More-than-Moore Technologies Division in R&D, TSMC

Dr. Alexander Kalnitsky is Vice President of More-than-Moore Technologies at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and he joined TSMC in 2009 as Senior Director of the More-than-Moore Technologies Division.

Dr. Kalnitsky was elected as a TSMC Fellow in 2013. He is a well-respected technical leader in the industry with an excellent proven track record in HV/Power/Analog/RF/CIS/MEMS and embedded NVM processes development. Dr. Kalnitsky has over 180 patents globally including 66 U.S. patents. He also has over 120 publications in technical journals and conference presentations.

Prior to joining TSMC, Dr. Kalnitsky worked for over 30 years in the semiconductor industry at international companies such as Intersil, Maxim Integrated Product, National Semiconductor, ST Microelectronics and Northern Telecom.

Dr. Kalnitsky received his M.S. degree in Applied Sciences from the University of Toronto, Canada and Ph.D. in Electrical Engineering from Carleton University, Canada.

Education:
  • PhD, Electrical Engineering, Duke University, USA
Experience:
  • Vice President, Research & Development / Design and Technology Platform, TSMC
  • Vice President, Technology and Manufacturing Group, Intel

Dr. Kevin Zhang currently serves as Vice President of Business Development. Prior to this role, Dr. Zhang served as Vice President of Design and Technology Platform. Before joining TSMC in November 2016, Dr. Zhang was Vice President of Technology and Manufacturing Group and Director of Circuit Technology at Intel, where he was responsible to the development of process design rules, circuit & device modeling, digital libraries, key analog and mixed-signal circuits. He led the development of embedded memory technologies from 90nm to 10nm at Intel. He was also responsible to the design and validation of lead vehicles for process technology development at Intel. Dr. Zhang was elected as Intel Fellow in 2005 and led his teams to win 5 Intel Achievement Awards, the highest technical accomplishments at the company.

Dr. Zhang has published more than 80 papers at international conferences and in technical journals and is the editor of Embedded Memory for Nano-Scale VLSIs, published by Springer in 2009. He holds 55 U.S. patents in the field of integrated circuit technology. Dr. Zhang was the 2016 International Solid-State Circuit Conference (ISSCC) Program chair and serves on IEEE VLSI Executive Committee. He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE). He received his bachelor's degree from Tsinghua University in Beijing and his Ph.D. from Duke University, both in electrical engineering.

Education:
  • Ph.D., Electrical Engineering, National Tsing Hua University
Experience:
  • Senior Director, Fab 12B, TSMC

Dr. T.S. Chang is Vice President of Product Development at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Dr. Chang joined TSMC in 1995 and was previously Senior Director of Fab12B. With more than 20 years of practical experience in the Operations Organization where he participated in technology development and manufacturing of Fab 1, Fab 4, Fab 8, Fab 12, and Fab 14, Dr. Chang is a key person to successfully transferring TSMC's leading-edge technology into production.

Dr. Chang was elected as a TSMC fellow in 2013, demonstrating his commitment to innovation and engineering excellence. He has 52 patents globally and about half of them are U.S. patents.

Dr. Chang received his B.S. degree in Electrical Engineering; M.S. degree in Electrical Engineering and Ph.D. in Electrical Engineering, all from National Tsing Hua University.

Education:
  • Ph.D., Electrical Engineering, University of Wisconsin-Madison, USA
Experience:
  • Senior Director, N3 Platform Development Division, TSMC

Dr. Michael Wu is Vice President of Technology Development under Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He is currently responsible for 3nm technology development and is also in charge of TSMC’s Technology Development Effectiveness Office. Previously, Dr. Wu was Senior Director of the N3 Platform Development Division in the R&D organization. Dr. Wu joined TSMC R&D in 1996 and has since participated in advanced CMOS technology development from 0.13um, 90nm, 65nm to 28nm, and contributed greatly to successful development of 16nm and 7nm technologies.

Dr. Wu has received multiple recognitions including the National Industrial Innovation Award – Innovative Trailblazer of the Year in 2013, the National Management Excellence Award in 2015, and the Chinese Outstanding Engineer Award in 2017.

Dr. Wu served in several positions in the Executive Committee of the International Electron Devices Meeting (IEDM) from 2013 to 2016, and was Technical Program Chair and General Chair of VLSI-TSA in 2017 and 2018, respectively. Dr. Wu was inducted as a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) for his leadership in CMOS process integration. He has published 46 papers and holds a total of 72 patents in the field of semiconductor technology.

Dr. Wu received his B.S. degree in Electrical Engineering from National Cheng Kung University and both his M.S. degree and Ph.D. in Electrical Engineering from University of Wisconsin-Madison. He also received an EMBA degree in the Institute of Technology Management from National Tsing Hua University.

Education:
  • Ph.D. , Physics, Stanford University, USA
Experience:
  • Senior Director, Pathfinding Division, TSMC

Dr. Min Cao was appointed Vice President of Pathfinding in Technology Development at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) in February 2018. Previously, Dr. Cao had served as Senior Director of TSMC's Pathfinding Division from 2016. Dr. Cao began his career at TSMC in 2002, and has successfully helped develop multiple generations of advanced CMOS technology including N90, N65, N40, N28, N20, and N10.

From 2006 to 2008, Dr. Cao led the development of N40G, TSMC's first technology node utilizing super density scaling. In 2009, he led the development of N28HP, the company's first node utilizing HKMG technology. Dr. Cao later led his team to develop N20, winning the Taiwan Ministry of Economic Affairs' National Industry Innovation Award in 2013. He also led the development of N10 from 2014 to 2016.

Prior to joining TSMC, Dr. Cao worked at Hewlett-Packard Laboratories from 1994 to 1999, PDF Solutions from 1999 to 2000, and Pericom Semiconductor from 2000 to 2002.

Dr. Cao holds a total of 36 patents in the field of integrated circuit technology. He has served on many conference committees, including IEDM and the Symposia on VLSI Technology and Circuits. Dr. Cao received his B.S. degree in Electronic Engineering from Fudan University in Shanghai, M.S. degree in Physics from San Francisco State University, and his Ph.D. degree in Physics from Stanford University.

Education:
  • Ph.D., Electrical Engineering, Lehigh University, USA
Experience:
  • Professor of Electrical Engineering, Stanford University
  • Senior Manager of IBM Research

Dr. H.-S. Philip Wong is Vice President of Corporate Research at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for exploring new technologies. Prior to joining TSMC, Dr. Wong was at Stanford University, where he continues to serve as a Professor of Electrical Engineering and holds the Willard R. and Inez Kerr Bell Professorship in the School of Engineering. He has 16 years of research and path-finding experience at IBM Research, where many of his early research works have led to product technologies.

Dr Wong's research aims at translating discoveries in science into practical technologies, and has contributed to advancements in nanoscale science and technology, semiconductor technology, solid-state devices, and electronic imaging. He is the founding Faculty Co-Director of the Stanford SystemX Alliance and Faculty Director of the Stanford Non-Volatile Memory Technology Research Initiative (NMTRI). He has held numerous leadership positions at major multi-university research centers of the National Science Foundation and the Semiconductor Research Corporation.

Dr. Wong is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) who holds 52 US patents. He has published over 600 papers at international conferences and technical journals, and is a co-author of a book and 11 book chapters. Dr. Wong and his students have won best paper awards at premier conferences such as the International Solid-State Circuits Conference (ISSCC) and Symposia on VLSI Technology and Circuits.

Dr. Wong received his B.Sc. (Hons.) from the University of Hong Kong, M.S. degree from Stony Brook University, Ph.D. from Lehigh University, all in electrical engineering. He also received an honorary doctorate degree from Institute Polytechnique de Grenoble, France.

Education:
  • Ph.D., Materials Science, University of Texas-Arlington, USA
Experience:
  • Senior Director, Operations / Backend Technology and Service Division, TSMC
  • Vice President, Chartered Semiconductor Manufacturing Ltd.
  • Technology Manager, Applied Materials

Dr. Marvin Liao has served as Vice President of the Advanced Packaging Technology and Service at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) since November 2018. Dr. Liao is responsible for the management of the Company’s backend business and operations, including bumping, circuit testing, and manufacturing of advanced packaging solutions including InFO and CoWoS, as well as turnkey services.

Dr. Liao joined TSMC in 2002 and during his career with the Company, he has served as Director of Fab 6 and Senior Director of Backend Technology.

Prior to joining TSMC, Dr. Liao worked for over 12 years in the semiconductor industry at companies such as Chartered Semiconductor, Applied Materials, and SGS Thomson Microelectronics.

Dr. Liao received his B.S. degree from National Tsing Hua University, and his M.S. and Ph.D. degrees from the University of Texas-Arlington, in Materials Science.

Education:
  • M.S., Chemical Engineering, National Tsing Hua University, Taiwan
Experience:
  • Senior Director, Fab 15B, TSMC

Y.H. Liaw was appointed Vice President of Operations at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) in February 2019. Since joining TSMC in 1988, Y.H. Liaw held a wide range of manufacturing positions including thin film, etching, and lithography engineering. He has been director of Fab 5, Fab 8, and Fab 15.

As Director of Fab 15, he successfully led the volume production of 28-nanometer technology with innovations in cross-organizational collaboration including the “Central Setup Team” which helped Fab 15 break records for rapid equipment move-in, and the “Super Manufacturing Platform”, which enabled smooth technology transfer from R&D to manufacturing. For his efforts, in 2013 he received the R.O.C. National Management Excellence Award as well as the TSMC Medal of Honor.

Y.H. Liaw received his B.S. and M.S. degrees in Chemical Engineering from National Tsing Hua University.

Education:
  • Ph.D., Materials Science & Engineering, Massachusetts Institute of Technology
Experience:
  • Senior Director, Advanced Tool and Module Development Division, TSMC

Dr. Simon Jang is Vice President of Advanced Tool and Module Development of Technology Development under the Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to this appointment, Dr. Jang served as Senior Director of the Advanced Tool and Module Development Division. Dr. Jang joined TSMC in 1993 and has since been responsible for managing advanced module technology development, including tool and material evaluation and selection, for critical semiconductor production modules.

In his early tenure with TSMC, Dr. Jang held many different positions in the company's research and development function, covering a wide spectrum of module technology. Dr. Jang was Director of Advanced Etch, BEOL (Back end of line) Module, and Platform Module. Under his leadership, the Advanced Module team consistently developed and delivered critical modules for advanced N28/N20/N16/N10/N7/N5 technologies. Dr. Jang was also one of the key contributors for breakthroughs in self-aligned contact formation and FinFET transistor and advanced interconnect fabrication. Dr. Jang has received more than 320 U.S. patents and published 147 papers in semiconductor technology.

Dr. Jang received the “National Industrial Innovation Award” and “National Outstanding Manager Award” in 2019 and 2011, respectively. Before joining TSMC, Dr. Jang was a project research assistant at Microsystems Technology Laboratories, MIT.

Dr. Jang received both his B.S. degree and M.S. degree in Materials Science & Engineering from National Tsing Hua University, and his Ph.D. in Materials Science & Engineering from Massachusetts Institute of Technology.

Education:
  • MBA, Cornell University, U.S.A.
Experience:
  • Deputy Chief Financial Officer, TSMC
  • Senior Director, Finance Division, TSMC
  • Vice President, Corporate Finance, ING Barings
  • Vice President, Corporate Finance, Chase Manhattan Bank
  • Vice President, Corporate Finance, Bankers Trust Company

Mr. Wendell Huang is the Chief Financial Officer and Spokesperson of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).

Mr. Huang joined TSMC in 1999 and has led a number of significant corporate level finance projects, such as the acquisitions of TASMC and WSMC, the sale of Philips' shares in TSMC to institutional investors, and a series of major bond issues in 2010-2013. In his past two decades of service at TSMC, Mr. Huang has been responsible for the management of the Finance Division including Investment Management, Financial Planning, SEC Compliance, Customer Credit, Foreign Exchange Management, Financial Risk Management, and Funding & Cashier. He was appointed Deputy Chief Financial Officer in January 2019.

Prior to joining TSMC, Mr. Wendell Huang worked for ING Barings, Chase Manhattan Bank, Bankers Trust Company, Chemical Bank, and Bank of Boston. Mr. Huang has more than 30 years of working experience in the field of finance.

Mr. Wendell Huang received his B.B.A degree in Statistics from the National Chengchi University and his MBA degree from Cornell University.

Regional Executives
Education:
  • MBA, University of St. Thomas
Experience:
  • President of TSMC North America
  • Executive Vice President of TSMC North America

Dave Keller currently serves as President and Chief Executive Officer of TSMC North America. Prior to his recent appointment, Dave was President of TSMC North America. Dave has three decades of semiconductor industry experience and joined TSMC in 1997 as Director of Account Management for North America, making significant contribution to ensure the best customer experience in North America over the last two decades.

Prior to joining TSMC, Dave served as sales and marketing executives at Fairchild Semiconductor Company (later acquired by National Semiconductor). He held several senior sales and marketing roles during his National career, such as Director of the networking segment business unit and VP of Americas marketing. He began his career as a product and process engineer at Honeywell in Minneapolis, Minn., then lived in Phoenix, Ariz., before settling in California.

He earned his Bachelor of Science degree in Electrical Engineering (B.S.E.E.) from North Dakota State University and his MBA degree from the University of St. Thomas, St. Paul, Minn.

Education:
  • Ph.D., Telecommunications Engineering, Universidad Politecnica de Madrid, Spain
Experience:
  • Senior Vice President and General Manager, Sales and Marketing, NXP Semiconductors/Philips Semiconductors

Mrs. Maria Marced is President of TSMC Europe, with responsibility for driving the development, strategy and management of TSMC's business in Europe, Middle East and Africa.

Before joining TSMC, Maria was Senior Vice President of Sales and Marketing at NXP /Philips Semiconductors.

She also served as Philips' General Manager of the Connected Multimedia Solutions Business Unit overseeing semiconductor solutions for Connected Consumer applications.

Dr Marced spent over 19 years at Intel where she developed her professional career rising to become Vice President and General Manager responsible for Europe, Middle East and Africa region .

Dr Marced currently serves as Chairwoman on the Global Semiconductor Alliance (GSA) EMEA leadership council, an organization dedicated to the advancement of the worldwide semiconductor industry.

Maria Marced holds a PhD in Telecommunications Engineering at Universidad Politecnica de Madrid, Spain.

Education:
  • MBA, Willamette University, USA
Experience:
  • Vice President, TSMC Japan

Makoto Onodera currently serves as Representative Director, President of TSMC Japan Limited, a wholly owned subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC) since 1997.

Prior to his career at TSMC, Makoto Onodera was Senior Marketing Engineer at Applied Materials Japan, Inc. where he was responsible for advanced Dielectric Chemical Vapor Deposition systems in various sales and marketing functions.

Makoto Onodera received his Master of Business Administration (MBA) degree from George H. Atkinson Graduate School of Management at Willamette University in 1991.

Education:
  • EMBA, Tulane University, USA
Experience:
  • Vice President, Human Resources, TSMC
  • Senior Director, Corporate Planning Organization, TSMC

Mr. L.C. Tu was appointed as President of TSMC China in March 2013. He joined TSMC when it was founded in 1987.

From 1993 to 2003, Mr. Tu served as Fab Director of Fab3, Fab4, WaferTech, and Fab5. He made contributions to integrate CIM, SMIF, and manufacturing technology for cycle time and operation efficiency improvement. From 2003 and to 2009, Mr. Tu served as Senior Director of Corporate Planning. During that time, he established company-wide procedures for supply chain management, pricing, demand forecast, cost management, Capex planning and customer logistics support. He also enhanced the Company's planning efficiency through collaborative information technology implementation. From 2009 and to 2013, Mr. Tu served as Vice President of Human Resources. He restructured Human Resources information management system.

Prior to joining TSMC, Mr. Tu worked as an engineer with the Industrial Technology Research Institute's Electronics Research and Service Organization (ERSO-ITRI).

Mr. Tu earned his B.S. in Industrial Engineering from Chung Yuan University and his MBA from Tulane University.

Education:
  • MBA, Peking University, China
Experience:
  • Vice President of TSMC China

Mr. Luo was appointed President of TSMC Nanjing in June, 2019.

Mr. Luo joined TSMC in 1994. He was previously Executive of Asia Account Management and Chief Operation Officer, TSMC-Europe. Since Mr. Luo was appointed Leader of China Business Development in 2003, and TSMC Nanjing in 2016, he has been dedicated himself to the development & growth of China semiconductor business.

Mr. Roger Luo was born in Taiwan, and his ancestors came from Jiangxi, China. Mr. Luo received his MBA degree from China Peking University, and EE B.S. degree from Taiwan Chiao-Tung University.

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