- Ph.D., Electrical Engineering and Computer Science, University of California, Berkeley, USA
- President and Co-CEO, TSMC
- Senior Vice President, Operations, TSMC
- Senior Vice President, Advanced Technology Business, TSMC
- Vice President, South-Site Operation, TSMC
- President, Worldwide Semiconductor Manufacturing Corp.
Dr. Mark Liu is currently Chairman at TSMC. Prior to assuming this post, he was President and Co-CEO from November 2013 to June 2018 and Co-Chief Operating Officer from March 2012 to November 2013. Before that, he was Senior Vice President of Operations from 2009 to 2012. From 2006 to 2009, he was a Senior Vice President responsible for the Advanced Technology Business at TSMC. He served in a number of executive positions at TSMC Fabs and the Operations organization from 2000 to 2006, and from 1999 to 2000, he was President of Worldwide Semiconductor Manufacturing Corp.
Prior to joining TSMC, from 1987 to 1993, he was with AT&T Bell Laboratory, Holmdel, NJ, as a research manager for the High Speed Electronics Research Laboratory, working on optical fiber communication systems. From 1983 to 1987, he was a process integration manager of CMOS technology development at Intel Corporation, Santa Clara, CA, developing silicon process technologies for Intel microprocessors.
Mark Liu received B.S. degree in electrical engineering from National Taiwan University. He received M.S. and Ph.D. degrees in electrical engineering and computer science from University of California, Berkeley.
- Ph.D., Electrical Engineering, Yale University, USA
- President and Co-CEO, TSMC
- Senior Vice President, Business Development, TSMC
- Senior Vice President, Mainstream Technology Business, TSMC
- Vice President, South-Site Operation, TSMC
- Senior Vice President, Technology, Chartered Semiconductor Manufacturing Ltd.
Dr. C. C. Wei joined TSMC in 1998 and currently serves as Chief Executive Officer and Vice Chairman. Prior to his recent appointment, Dr. Wei was TSMC's President and Co-CEO from November 2013 to June 2018 and Co-Chief Operating Officer from March 2012 to November 2013. From 2009 to 2012, he was TSMC's Senior Vice President of Business Development. Before that, he was Senior Vice President of Main Stream Technology Business.
Before joining TSMC, he was Senior Vice President of Technology at Chartered Semiconductor and Senior Manager, Logic and SRAM technology development at ST Microelectronics.
C. C. Wei received B.S. degree in electrical engineering from National Chiao Tung University. And later he was awarded his PhD by Yale University.
- EMBA, National Taiwan University, Taiwan
- Senior Vice President, Chief Financial Officer and Spokesperson, TSMC
- Vice President, Chief Financial Officer and Spokesperson, TSMC
- Vice President, TI-Acer Semiconductor Manufacturing Corp.
Lora Ho is the Chief Financial Officer and Spokesperson of Taiwan Semiconductor Manufacturing Company Limited (TSMC).
Joined TSMC in 1999, Ms. Ho served as Corporate Controller from 1999 to 2003, and became the Chief Financial Officer since 2003. Prior to TSMC, Ms. Ho served various positions in Accounting and Finance field in Foreign invested companies.
Ms. Ho was awarded " Outstanding Financial Executive " for the year of 1993 by Financial Executives Institute, The " Best Companies' Best CFO " of Taiwan from 2007-2010 by FinanceAsia , also the Best CFO in Asia in 2011 by Institutional Investor.
Ms. Ho received her MBA degree from National Taiwan University in 2003 and a B.A. degree from National Cheng-chi University in 1978.
- Ph.D., Solid State Physics and Surface Chemistry, University of California, Berkeley, USA
- Vice President, Operations for Manufacturing Technology, TSMC
- Vice President, Advanced Technology Business, TSMC
- Vice President, Research & Development, TSMC
- Vice President, Operation II, TSMC
- Director, Advanced Technology Development & CTM Plant Manager, Intel
Dr. Lo is TSMC's Senior Vice President of Research and Development. Prior to this post, he served as Vice President of the Company's Advanced Technology Business.
Dr. Lo joined TSMC in 2004 as Vice President of Operations II and served as Vice President of Research & Development from 2006 to 2009.
Prior to joining TSMC, Dr. Lo was Director of Technology Development and Plant Manager with Intel Corporation's Technology and Manufacturing Group. From 1997 to 2000, he served a Factory Manager, responsible for running Intel's development factory in Santa Clara, California.
Dr. Lo has also worked at U.S. university, the Motorola Research and Development Lab and the Xerox Microelectronics Center.
Dr. Lo received his B.S. degree in physics from National Taiwan University and his M.S. and Ph.D. degrees in Solid State Physics and Surface Chemistry from University of California, Berkeley.
- B.S. degree in Engineering, United States Military Academy at West Point, USA
- Senior Vice President, Chief Executive Officer of TSMC North America
- Vice President of TSMC North America Account Management
Mr. Cassidy's electronics career began at Fairchild Semiconductor, later acquired by National Semiconductor. Over an 18-year span he rose through manufacturing, engineering, quality and reliability, and marketing, culminating with his appointment as Vice President and General Manager of National's Military & Aerospace Division and Co-Chair of National's General Manager Council.
He joined TSMC North America in 1997 as Vice President of Account Management; promoted to President, TSMC North America in 2005; elected Corporate Vice President, TSMC, Ltd. in 2008; and elected Senior Vice President, TSMC, Ltd. in 2014. Over nearly two decades at TSMC he has helped lead the company to record growth, while contributing greatly to the success of the fabless semiconductor business model. He currently serves on the Global Semiconductor Alliance (GSA) Board of Directors, an organization dedicated to the advancement of the worldwide semiconductor industry.
Prior to entering the semiconductor industry, Mr. Cassidy served as an officer in the U.S. Army. He holds a Bachelor of Science degree in Engineering from the United States Military Academy at West Point.
- M.S., Electrical Engineering, National Cheng-Kung University, Taiwan
- Vice President, Product Development in Operations, TSMC
Mr. Y.P. Chin was promoted to Sr. Vice President in November 2016. Prior to this post, Mr. Chin served as TSMC's Vice President of Operations for Product Development. Prior to this, he was Vice President of Advanced Technology Business in TSMC, sharing responsibility with Senior Vice President Dr. Mark Liu for TSMC's advanced technology and 300mm fab operations.
Mr. Chin joined TSMC when it was founded in 1987 and has made significant contribution to TSMC's product engineering capability throughout his career. He was Director of Fab 1 from 1997 to 1998, and in later positions helped manage yield improvement in all new generations of advanced technology, including 0.13-micron, 90nm, 65nm, and 45nm nodes. Mr. Chin pioneered the development of TSMC's Golden Spice Modeling methodology and Design For Manufacturing program.
Prior to joining TSMC, Mr. Chin worked as an engineer with the Industrial Technology Research Institute's Electronics Research and Service Organization (ERSO-ITRI).
Mr. Chin earned his B.S. and M.S. degrees in Electrical Engineering from National Cheng Kung University.
- PhD, Electrical Engineering, University of California, Los Angeles, USA
- Vice President, Technology Development in R&D, TSMC
Dr. Y.J. Mii was promoted to Sr. Vice President in November 2016. Prior to this post, Dr. Y.J. Mii served as TSMC's Vice President of Research and Development (R&D) since 2011. He joined TSMC in 1994 and has been involved continuously in the development and manufacturing of advanced CMOS technologies in both Fab Operation and R&D. Dr. Mii joined R&D in 2001, managing both 90nm and 40nm technology development. Following that he began supervising 28nm technology development, accelerating it to lead the foundry industry.
Dr. Mii was a research staff member at IBM Research before joining TSMC. He joined TSMC as a deputy manager of Fab 3 engineering, eventually rising to senior director of R&D before being promoted.
He holds a B.S. in electrical engineering from National Taiwan University, as well as an M.S. and Ph.D. in Electrical Engineering from the University of California, Los Angeles (UCLA).
- B.S. degree in Industrial Education & Technology, National Changhua University of Education
- Vice President of Mainstream Fabs and Manufacturing Technology Center, TSMC
- Senior Director of Mainstream Fabs / Advanced Technology Business / Fab12 / Fab 6, TSMC
- Director of Fab7 / Fab 4 / Fab 3 / 300mm Project, TSMC
J.K. Linwas promoted to Sr. Vice President in November 2018. Prior to this post, Mr. Lin served as TSMC's Vice President of Information Technology and Materials Management & Risk Management. Prior to this, Mr. Lin served as Vice President of Mainstream Fabs and Manufacturing Technology Center.
J.K. Lin joined TSMC when it was founded in 1987 and held a number of manufacturing positions including Equipment Engineer, Section Manager, and Department Manager in Fab1 and 2. He was responsible for the construction of Fab 3 was later Fab Director of Fab 3, Fab 4, Fab7 and Senior Director for Fab 6, Fab 12, 300mm Fabs, Mainstream Fabs.Prior to joining TSMC, Mr. Lin worked in the Electronic Research & Service Organization (ERSO) of Taiwan's Industrial Technology Research Institute (ITRI).
J.K. Lin earned his B.S. degree from National Changhua University of Education.
- M.S., Chemical Engineering, National Cheng-Kung University, Taiwan
- Vice President, 300mm Fabs Operations, TSMC
- Senior Director of 300mm Fabs / Mainstream Technology Business / Fab14, TSMC
- Director of Fab3 / Fab4, TSMC
J.K. Wang was promoted to Sr. Vice President in November 2018. Prior to this post, he was the Vice President of 300mm fabs operations.
J.K. Wang has served at TSMC since the company was founded in 1987. During his career with TSMC, he has been involved in many different aspects of the company's operations, including module engineering, process integration, R&D technology development, manufacturing, and fab management. Previously, he had been the Fab Director of Fab 3 / Fab 4, and Senior Director for Fab14, mainstream & 300mm Fabs. Mr. Wang has been deeply involved in building up TSMC's manufacturing technology and systems, particularly the fab automation and manufacturing infrastructure.
J.K. Wang received his B.S. and M.S. degrees in chemical engineering from National Cheng-Kung University in 1981 and 1983 respectively.
- Ph.D., Materials Science and Engineering, Cornell University, USA
- Senior Director, Corporate Planning Organization, TSMC
- General Manager, Technology Group, IBM Taiwan
Dr. Irene Sun is currently TSMC's Vice President Corporate Planning. Prior to this post, she was Senior Director of the Corporate Planning Organization. She joined TSMC in October 2003 as Director of the Corporate Pricing Division.
Prior to TSMC, Dr. Sun worked at IBM for 23 years and held a variety of management positions in R&D, Manufacturing Engineering, Marketing & Sales, and Business Management.
Dr. Sun received her B.S. degree in Nuclear Engineering from National Tsinghua University in Taiwan, and her Ph.D. in Materials Science and Engineering from Cornell University.
- Ph.D., Electrical and Computer Engineering, Syracuse University, USA
- Senior Director, Design and Technology Platform, TSMC
- Section Manager, ITRI/CCL Taiwan
Dr. Cliff Hou was appointed TSMC's Vice President of Research and Development (R&D) in August, 2018. Prior to this post, Dr. Hou served as TSMC's Vice President at Design and Technology Platform from August, 2011 to July, 2018. He joined TSMC in 1997 and has made profound contribution to TSMC's design technology and ecosystem development.
Over the last decade at TSMC, Dr. Hou helped the company establish TSMC's Open Innovation Platform® (OIP), which has become one of the most powerful design ecosystems in the global semiconductor industry. From 1997 to 2007, Dr. Hou established the company's technology design kit and reference flow development organizations.
Prior to joining TSMC, Dr. Hou was a section manager specializing in physical verification methodologies at the Computer & Communications Research Laboratories, Industrial Technology Research Institute (ITRI/CCL) in Taiwan; and served as an Associate Professor at Kaohsiung Polytechnic Institute, Taiwan.
Dr. Hou received National Manager Excellence Award in 2010. He led the company's Open Innovation Platform project team to win First National Industry Innovation Award in 2011 by the Ministry of Economic Affairs (MOEA), Taiwan.
Dr. Hou holds 46 U.S. Patents and serves as a member of Board of Directors in Global Unichip Corp. He received his B.S. degree in Control Engineering from Taiwan's National Chiao-Tung University, and his Ph.D. in Electrical and Computer Engineering from Syracuse University.
- Master of Comparative Law, School of Law, University of Iowa
- Associate General Counsel, TSMC
- Director, Corporate Legal Division, TSMC
- Senior Associate, Taiwan International Patent and Law Office (TIPLO)
Sylvia Fang was appointed Vice President and General Counsel for TSMC in August, 2014. Previously, she served as Associate General Counsel, heading that organization since February, 2014. Sylvia joined TSMC in 1995. She was previously Director at Corporate Legal Division where she worked on numerous high-profile corporate transactions, precedent-setting intellectual property trade secret litigations, the promotion of significant legal changes and the resolution of corporate governance issues. She also has been working extensively with the Board of Directors, including the independent directors on various Board, Audit Committee and Compensation Committee matters and other special projects.
Prior to her career at TSMC, Sylvia worked at a leading boutique intellectual property law firm (TIPLO) where she developed her expertise on general corporate and IP issues.
The global legal community recognized Sylvia's achievement in 2005 when the leading publication Asialaw magazine awarded her the “2005 Deep & Far Award for Taiwan In-House Counsel”. She is also known among key government trade, commerce and securities law administrative agencies due to her relations cultivated over the years of promoting important legal changes to support corporate goals.
Sylvia is an attorney admitted in Taiwan having received her LL.B. degree from National Taiwan University, and her M.C.L. from School of Law, University of Iowa.
- EMBA, International Business Management, National Taiwan University
- Director of Human Resources, TSMC
- Senior Vice President of Global Human Resources, Trend Micro Inc.
Connie Ma has been appointed as Vice President of Human Resources since August 2014. She joined TSMC in June 2014 as Director of Human Resources.
Connie has over 30 years of HR experience. Prior to joining TSMC, she held several senior HR managerial positions at Trend Micro Inc., NCR Corporation and AT&T Corporation. Connie was Senior Vice President of Global Human Resources at Trend Micro where she led corporate transformation by building a global HR team to enhance the execution of corporate strategy and culture in terms of realigning organization structure, strengthening global collaboration and facilitating employee engagement.
Connie holds an EMBA from National Taiwan University and a bachelor's degree in business administration from Soochow University.
- PhD, Electrical Engineering, National Chiao Tung University
- Senior Director, Fab 14B, TSMC
Dr. YL Wang was appointed TSMC's Vice President of Technology Development (TD) in October 2015. Prior to this post, Dr. Wang served as Senior Director of Fab 14B.
Dr. Wang joined TSMC in 1992 and has been deeply involved in building TSMC's manufacturing technology and methodology. During his 20+ years career, he successfully contributed to mass-production of the company's 0.35-micorn, 0.25-micorn, 0.18-micorn, 0.13-micorn, 90nm, 65nm, 40nm, 20nm and 16nm process technologies, providing significant productivity improvement and defect density enhancement.
Dr. Wang received his B.S. degree in Physics from National Tsing Hua University; his M.S. degree in Materials Science from National Sun Yat-Sen University and Ph.D. in Electrical Engineering and Computer Science from the National Chiao Tung University. He has 109 US patents, and over 100 Republic of China, Peoples Republic of China ,and French patents.
- PhD, Materials Engineering, Georgia Institute of Technology, USA
- Senior Director of Integrated Interconnect & Packaging Division in R&D, TSMC
Dr. Doug Yu was appointed TSMC's Vice President in November 2016. Dr. Yu joined TSMC in 1994. He was previously Senior Director of the Integrated Interconnect & Packaging Division, where he led the development of interconnect technology for integrated circuits.
Dr. Yu received his B.S. degree in Physics and M.S. degree in Materials Science and Engineering both from National Tsing Hua University, and his Ph.D. in Materials Engineering from Georgia Institute of Technology. In 2013, he was elevated to IEEE fellow grade.
- PhD, Electrical Engineering, Carleton University, Canada
- Senior Director of More-than-Moore Technologies Division in R&D, TSMC
Dr. Alexander Kalnitsky was appointed TSMC's Vice President in November 2016. Prior to this appointment, Dr. Kalnitsky served as a Senior Director of the More-than-Moore Technologies Division.
Dr. Kalnitsky joined TSMC in 2009. At TSMC, he is a well-respected technical leader with an excellent track record in HV/Power/Analog/RF/CIS/MEMS processes development. He was elected a TSMC Fellow in 2013.
Prior to joining TSMC, Dr. Kalnitsky worked for over 30 years in the semiconductor industry at companies such as Intersil, Maxim Integrated Product, National Semiconductor, STMicroelectronics and Northern Telecom.
Dr. Kalnitsky received his M.S. degree in Applied Sciences from the University of Toronto, Canada and Ph.D. in Electrical Engineering from Carleton University, Canada. He authored or co-authored over 140 issued U.S. patents (over 20 invention disclosures filed while at TSMC). Alex has over 120 publications in technical journals and conference presentations.
- PhD, Electrical Engineering, Duke University, USA
- Vice President, Research & Development / Design and Technology Platform, TSMC
- Vice President, Technology and Manufacturing Group, Intel
Dr. Kevin Zhang currently serves as Vice President of Business Development. Prior to this role, Dr. Zhang served as Vice President of Design and Technology Platform. Before joining TSMC in November 2016, Dr. Zhang was Vice President of Technology and Manufacturing Group and Director of Circuit Technology at Intel, where he was responsible to the development of process design rules, circuit & device modeling, digital libraries, key analog and mixed-signal circuits. He led the development of embedded memory technologies from 90nm to 10nm at Intel. He was also responsible to the design and validation of lead vehicles for process technology development at Intel. Dr. Zhang was elected as Intel Fellow in 2005 and led his teams to win 5 Intel Achievement Awards, the highest technical accomplishments at the company.
Dr. Zhang has published more than 80 papers at international conferences and in technical journals and is the editor of Embedded Memory for Nano-Scale VLSIs, published by Springer in 2009. He holds 55 U.S. patents in the field of integrated circuit technology. Dr. Zhang was the 2016 International Solid-State Circuit Conference (ISSCC) Program chair and serves on IEEE VLSI Executive Committee. He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE). He received his bachelor's degree from Tsinghua University in Beijing and his Ph.D. from Duke University, both in electrical engineering.
- PhD, Electrical Engineering, National Tsing Hua University
- Senior Director, Fab 12B, TSMC
Dr. T.S. Chang was appointed TSMC's Vice President in February 2018. Dr. Chang joined TSMC in 1995 and was previously Operations Organization's Senior Director of Fab12B. Since joining TSMC, Dr. Chang has participated in the development of Fab 1, Fab 4, Fab 8, Fab 12 and Fab 14, having more than 24 years of practical experience in Operations Organization. Dr. Chang is a key person to implement TSMC's leading edge technology into manufacturing.
Dr. Chang received his B.S. degree in Electrical Engineering; M.S. degree in Electrical Engineering and Ph.D. in Electrical Engineering all from National Tsing Hua University.
- PhD, Electrical Engineering, University of Wisconsin-Madison, USA
- Senior Director of N3 Platform Development Division in R&D, TSMC
Dr. Michael Wu was appointed TSMC's Vice President in February 2018. Dr. Wu joined TSMC R&D in 1996 and participated in advanced CMOS technology development from 0.13um, 90nm, 65nm, 28nm, 16nm to 7nm node in the past 20+ years. He was previously R&D Organization's Senior Director of N3 Platform Development Division. Dr. Wu is a key person to the success of 16FF and 7nm technologies. He is responsible for 3nm technology development as well.
Dr. Wu received his B.S. degree in Electrical Engineering from National Cheng Kung University; his M.S. degree in Electrical Engineering and Ph.D. in Electrical Engineering both from University of Wisconsin-Madison. Michael also received an EMBA degree in the Institute of Technology Management from National Tsing Hua University. He is an IEEE Fellow for his leadership in CMOS process integration. He has published 45 papers and holds 55 patents in the field of semiconductor technology.
- PhD, Physics, Stanford University, USA
- Senior Director of Pathfinding Division in R&D, TSMC
Dr. Min Cao was appointed TSMC's Vice President in February 2018. Dr. Cao joined TSMC in 2002. He has participated in successful development of multiple generations of advanced CMOS technology including N90, N65, N40, N28, N20 and N10. From 2006-2008, he led the development of N40G, the first TSMC technology node utilizing super density scaling (significantly higher than 2x). In 2009, he led the development of N28HP, the 1st TSMC node utilizing HKMG technology. He led the development of N20 from 2010 to 2013, and N10 from 2014 to 2016. Since 2016, Dr. Cao has served as a Senior Director of Path-finding Division.
Prior to joining TSMC, he worked at Hewlett-Packard Laboratories from 1994-1999, PDF Solutions from 1999-2000, and Pericom Semiconductor from 2000-2002, all in the US.
Dr. Cao holds 36 U.S. patents in the field of integrated circuit technology. He has served on many conference committees including IEDM and VLSI Symposium. Min Cao received his B.S. degree in Electronic Engineering from Fudan University in Shanghai, M.S. degree in Physics from San Francisco State University, and his Ph.D. degree in Physics from Stanford University.
- PhD, Electrical Engineering, Lehigh University, USA
- Willard R. and Inez Kerr Bell Professor in the School of Engineering, Stanford University
- Professor of Electrical Engineering, Stanford University
- Senior Manager of IBM Research
Dr. H.-S. Philip Wong currently serves as Vice President of Corporate Research responsible for exploring new technologies for TSMC. Prior to joining TSMC, Dr. Wong is Professor of Electrical Engineering and holds the Willard R. and Inez Kerr Bell Professorship in the School of Engineering at Stanford University. He has 16 years of research and path-finding experience at IBM Research, where many of his early research works have led to product technologies. His research aims at translating discoveries in science into practical technologies and has contributed to advancements in nanoscale science and technology, semiconductor technology, solid-state devices, and electronic imaging. He is the founding Faculty Co-Director of the Stanford SystemX Alliance and Faculty Director of the Stanford Non-Volatile Memory Technology Research Initiative (NMTRI). He has held leadership positions at major multi-university research centers of the National Science Foundation and the Semiconductor Research Corporation.
Dr. Wong received his B.Sc. (Hons.) from the University of Hong Kong, his M.S. degree from Stony Brook University, and his Ph.D. from Lehigh University, all in electrical engineering. He has published over 600 papers at international conferences and technical journals and is the co-author of a book and 11 book chapters. He holds 52 US patents. He is an IEEE Fellow. He received the honorary doctorate degree from Institut Polytechnique de Grenoble, France. Dr. Wong and his students have won best paper awards at premier conferences such as the International Solid-State Circuits Conference (ISSCC) and Symposia on VLSI. He served as General Chair of the International Electron Devices Meeting (IEDM) and is currently the Chair of the IEEE Executive Committee of the Symposia on VLSI Technology and Circuits.
- PhD, Materials Science, University of Texas-Arlington, USA
- Senior Director, Operations / Backend Technology and Service Division, TSMC
- Vice President, Chartered Semiconductor Manufacturing Ltd.
- Technology Manager, Applied Materials
Dr. Marvin Liao was appointed TSMC's Vice President in November 2018. Dr. Liao joined TSMC in 2002 and is currently Vice President of the Advanced Packaging Technology and Service. He is responsible for the management of backend business and operations, including bumping, InFO, CoWoS, Circuit testing, and turnkey services. During his career with TSMC, Dr. Liao was Technical Director of Fab 6 and Senior Director of Backend Technology.
Dr. Liao received his B.S. degree from National Tsing Hua University, his M.S. and Ph.D. degrees from the University of Texas-Arlington, in Materials Science. Prior to joining TSMC, Dr. Liao worked for over 12 years in the semiconductor industry at companies such as Chartered Semiconductor, Applied Materials and SGS Thomson Microelectronics.
- M.S., Chemical Engineering, National Tsing Hua University, Taiwan
- Senior Director, Fab 15B, TSMC
Y.H. Liaw was appointed Vice President of Operations at TSMC in February 2019. Since joining TSMC in 1988, Y.H. Liaw held a wide range of manufacturing positions including thin film, etching, and lithography engineering. He has been director of Fab 5, Fab 8, and Fab 15.
As Director of Fab 15, he successfully led the volume production of 28-nanometer technology with innovations in cross-organizational collaboration including the “Central Setup Team” which helped Fab 15 break records for rapid equipment move-in, and the “Super Manufacturing Platform”, which enabled smooth technology transfer from R&D to manufacturing. For his efforts, in 2013 he received the R.O.C. National Management Excellence Award as well as the TSMC Medal of Honor.
Y.H. Liaw received his B.S. and M.S. degrees in Chemical Engineering from National Tsing Hua University.
- MBA, University of St. Thomas
- President of TSMC North America
- Executive Vice President of TSMC North America
Dave Keller currently serves as President and Chief Executive Officer of TSMC North America. Prior to his recent appointment, Dave was President of TSMC North America. Dave has three decades of semiconductor industry experience and joined TSMC in 1997 as Director of Account Management for North America, making significant contribution to ensure the best customer experience in North America over the last two decades.
Prior to joining TSMC, Dave served as sales and marketing executives at Fairchild Semiconductor Company (later acquired by National Semiconductor). He held several senior sales and marketing roles during his National career, such as Director of the networking segment business unit and VP of Americas marketing. He began his career as a product and process engineer at Honeywell in Minneapolis, Minn., then lived in Phoenix, Ariz., before settling in California.
He earned his Bachelor of Science degree in Electrical Engineering (B.S.E.E.) from North Dakota State University and his MBA degree from the University of St. Thomas, St. Paul, Minn.
- Ph.D., Telecommunications Engineering, Universidad Politecnica de Madrid, Spain
- Senior Vice President and General Manager, Sales and Marketing, NXP Semiconductors/Philips Semiconductors
Mrs. Maria Marced is President of TSMC Europe, with responsibility for driving the development, strategy and management of TSMC's business in Europe, Middle East and Africa.
Before joining TSMC, Maria was Senior Vice President of Sales and Marketing at NXP /Philips Semiconductors.
She also served as Philips' General Manager of the Connected Multimedia Solutions Business Unit overseeing semiconductor solutions for Connected Consumer applications.
Dr Marced spent over 19 years at Intel where she developed her professional career rising to become Vice President and General Manager responsible for Europe, Middle East and Africa region .
Dr Marced currently serves as Chairwoman on the Global Semiconductor Alliance (GSA) EMEA leadership council, an organization dedicated to the advancement of the worldwide semiconductor industry.
Maria Marced holds a PhD in Telecommunications Engineering at Universidad Politecnica de Madrid, Spain.
- MBA, Willamette University, USA
- Vice President, TSMC Japan
Makoto Onodera currently serves as Representative Director, President of TSMC Japan Limited, a wholly owned subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC) since 1997.
Prior to his career at TSMC, Makoto Onodera was Senior Marketing Engineer at Applied Materials Japan, Inc. where he was responsible for advanced Dielectric Chemical Vapor Deposition systems in various sales and marketing functions.
Makoto Onodera received his Master of Business Administration (MBA) degree from George H. Atkinson Graduate School of Management at Willamette University in 1991.
- EMBA, Tulane University, USA
- Vice President, Human Resources, TSMC
- Senior Director, Corporate Planning Organization, TSMC
Mr. L.C. Tu was appointed as President of TSMC China in March 2013. He joined TSMC when it was founded in 1987.
From 1993 to 2003, Mr. Tu served as Fab Director of Fab3, Fab4, WaferTech, and Fab5. He made contributions to integrate CIM, SMIF, and manufacturing technology for cycle time and operation efficiency improvement. From 2003 and to 2009, Mr. Tu served as Senior Director of Corporate Planning. During that time, he established company-wide procedures for supply chain management, pricing, demand forecast, cost management, Capex planning and customer logistics support. He also enhanced the Company's planning efficiency through collaborative information technology implementation. From 2009 and to 2013, Mr. Tu served as Vice President of Human Resources. He restructured Human Resources information management system.
Prior to joining TSMC, Mr. Tu worked as an engineer with the Industrial Technology Research Institute's Electronics Research and Service Organization (ERSO-ITRI).
Mr. Tu earned his B.S. in Industrial Engineering from Chung Yuan University and his MBA from Tulane University.
- MBA, Peking University, China
- Vice President of TSMC China
Mr. Luo was appointed President of TSMC Nanjing in June, 2019.
Mr. Luo joined TSMC in 1994. He was previously Executive of Asia Account Management and Chief Operation Officer, TSMC-Europe. Since Mr. Luo was appointed Leader of China Business Development in 2003, and TSMC Nanjing in 2016, he has been dedicated himself to the development & growth of China semiconductor business.
Mr. Roger Luo was born in Taiwan, and his ancestors came from Jiangxi, China. Mr. Luo received his MBA degree from China Peking University, and EE B.S. degree from Taiwan Chiao-Tung University.