Maintaining dependable capacity is a key part of TSMC’s manufacturing strategy. The Company currently operates three 12-inch GIGAFAB® facilities – Fabs 12, 14 and 15. The combined capacity of the three facilities exceeded eight million 12-inch equivalent wafers in 2019. Production within these three facilities supports 0.13μm, 90nm, 65nm, 40nm, 28nm, 20nm, 16nm, 10nm, and 7nm process technologies, including each technology’s sub-nodes. Fab 18 expects to start volume production using 5nm processes in early 2020 and will be TSMC’s fourth 12-inch GIGAFAB® facility. An additional portion of the capacity is reserved for R&D work on leading-edge manufacturing technologies, which currently supports the technology development of the 3nm, 2nm node and beyond.

The three GIGAFAB® facilities are coordinated by a centralized fab manufacturing management system known as super manufacturing platform (SMP) to provide customers with more consistent quality and reliability, improved flexibility to cope with demand fluctuations, faster yield learning and time-to-volume, and lower-cost product requalification.

  Mini Mega Giga
Profile Monthly 300mm capacity (pcs) ~10K ~25K >100K
Customer Values Operating cost High Medium Low
  Flexibility Limited Medium High
  Ramp-up agility Limited Medium High
  Cycle time Long Medium Short
  Delivery precision Limited Medium High