Maintaining dependable capacity is a key part of TSMC’s manufacturing strategy. The Company currently operates four 12-inch GIGAFAB® facilities – Fabs 12, 14, 15 and 18. The combined capacity of the four facilities exceeded nine million 12-inch equivalent wafers in 2020. Fab 12, 14 and 15 support 0.13μm, 90nm, 65nm, 40nm, 28nm, 20nm,16nm, 10nm, and 7nm process technologies, including each technology’s sub-nodes. 5nm is currently accelerating into mass production at Fab 18. Besides, an additional portion of the capacity is built at Fab 12 for R&D work on leading-edge manufacturing technologies, which currently supports the technology development of 3nm and 2nm nodes and beyond.

  Mini Mega Giga
Profile Monthly 300mm capacity (pcs) ~10K ~25K >100K
Customer Values Operating cost High Medium Low
  Flexibility Limited Medium High
  Ramp-up agility Limited Medium High
  Cycle time Long Medium Short
  Delivery precision Limited Medium High