As advanced technology continues to evolve and IC geometry keeps shrinking, the need for tighter manufacturing process and quality control becomes extremely challenging. TSMC has tailored its manufacturing infrastructure to handle a diversified product portfolio that uses strict process control to meet tightened specs and higher product quality, performance and reliability requirements from customers. TSMC’s process control systems are integrated with numerous intelligent functions to achieve excellence in both quality and manufacturing. Through intelligent detection, smart diagnosis, and cognitive action, the Company produces remarkable yield enhancement, quality assurance, workflow improvement, fault detection, and cost reductions, while shortening its R&D cycle.

To meet AI’s stricter quality requirements for mobile, high performance computing (HPC), automotive and the Internet of Things (IoT), TSMC is implementing artificial intelligence (AI) and machine learning technologies, and has developed systems for precise fault detection and classification, intelligent advanced equipment control and intelligent advanced process control to ensure the consistency of tool matching and process stability. Combining intelligent process variation detection and engineering analysis with foundry know-how to identify potential defects and minimize the convergence of process variation through self-diagnosis and cognitive action. As the result, each chip can be precisely controlled at the nanometer level to produce the highest quality wafers for customers. In 2024, TSMC extended its intelligent manufacturing systems from the front-end fabs to the back-end fabs. This ensured significant improvements in product quality, product production cycle and machine productivity across all production stages, from wafer to die packaging.