The TSMC Grand Alliance is a powerful driving force behind semiconductor innovation. It brings together customers, OIP partners, including IP Alliance, EDA Alliance, Design Center Alliance, Cloud Alliance, Value Chain Alliance, TSMC 3DFabric® Alliance, and key equipment and materials suppliers to achieve greater collaboration. The TSMC Grand Alliance objective is to help customers, alliance members, and TSMC win business and stay competitive.
We know collaboration works. We have seen it in the great strides our customers and ecosystem members have made through the Open Innovation Platform®.
Today, the Open Innovation Platform® is an unmatchable design ecosystem and a key component of the Grand Alliance. Based solely on R&D investment it’s estimated that TSMC and ten of our customers collectively invest more in R&D than the top two semiconductor IDMs combined.
Through the Grand Alliance, TSMC relentlessly pursues its mission by collaborating with customers and partners. We rely on each other to stay competitive. We rely on each other to succeed. This is the power of the Grand Alliance.
