TSMC became the world's first semiconductor company that begins 20nm volume production, using its innovative double patterning technology, in 2014, and made record of TSMC's fastest ramping node in the same year. The accumulated wafer shipment till end of 2015 exceeds one million 12” wafers.
The 20nm technology provides better density and power value than previous technology nodes, due to using energy-efficient transistors and interconnects and world's leading double patterning technique. Compared to its 28nm node, the 20nm process provides 15% better performance and can reduce total power consumption by a third. It is ideal for both performance-driven products and mobile computing application migration.