TSMC's 5nm Fin Field-Effect Transistor (FinFET) process technology is optimized for both mobile and high performance computing applications. It is scheduled to start risk production in the second half of 2019.
TSMC's 5nm technology is the second available EUV process technology. It showed promising imaging capability with expected good wafer yield.
Our 5nm technology entered risk production in March 2019 and target for volume production in 2020.
Meanwhile, TSMC plans to announce N5P technology one year after 5nm technology announcement.