MEMS Technology

TSMC introduced the world's first Sensor SoC process technology in 2011. This technology manufactures monolithic Micro Electro Mechanical Systems (MEMS) by integrating TSMC's industry-leading Complementary Metal-Oxide-Semiconductor (CMOS) and wafer stacking technologies.

TSMC Sensor SoC technology ranges from 0.5-micron (µm) to 0.11µm and supports applications including G-Sensors, gyroscopes, pressure gauges, microfluidic, and biological gene chips.

In 2018, TSMC successfully delivered the world's first CMOS-MEMS (Micro-electromechanical Systems) monolithic capacitive barometer, which features sensitivity to altitude changes as small as 5 cm and fits in a package of slightly less than 1 mm2, for various system applications, including personal activity tracking and indoor navigation.

Future plans include the development of next-generation high-sensitivity thin microphone, MEMS Si-pillar TSV (through silicon via) technology.

Related Information