TSMC's Open Innovation Platform^® model brings together the creative thinking of customers and partners under the common goal of shortening: design time, time-to-volume, time-to-market, and, ultimately, time-to-revenue. The model features:

• The foundry segment's earliest and most comprehensive electronic design automation (EDA) certification program, delivering timely design tool enhancements required by new process technologies.
• A comprehensive portfolio of silicon-verified, production-proven, and quality-assessed intellectual properties (IP) and library.
• Cloud-based semiconductor design capabilities through Cloud-optimized methodologies for compute intensive applications, enabling customers to utilize the scalability, agility, and flexibility of cloud.
• Extensive design services to support customer demand for third-party resources and capabilities at various points and scopes along the semiconductor design value chain.
• Advanced 3D stacking and packaging solutions empowering customers to integrate multiple chips/chiplets for system-level design process.

Crucial to OIP are TSMC supported ecosystem interfaces and collaborative components that empower innovation throughout the supply chain.

TSMC's active accuracy assurance (AAA) initiative is key to OIP, providing the precision and quality required by the ecosystem’s interfaces and collaborative components.

The innovation from OIP partners is made accessible through a dedicated partner management portal, leveraging TSMC-Online, which facilitates ecosystem partner communication and enhances business-side productivity.

TSMC provides a robust design ecosystem, process technologies, and manufacturing excellence that are the foundation of the IC industry and promote the greatest degree of collaboration.