TSMC integrated turnkey service provides end-to-end technical and logistical customized 3D package solutions. With TSMC silicon SoC technology, 3D technologies and collaborating with IP, substrate and memory suppliers, enable customers to create the best solutions with heterogeneous integration, die partitioning, 2.5D/3D die stacking, and memory Integration.

The integrated turnkey service provides customer quick solutions for chip-packaging-integration (CPI) issues likely incurred during packaging manufacturing as a result of coefficient-of-thermal-expansion (CTE) mismatch between different packaging materials and components. CPI has become crucial as package sizes continue to scale up, and it is expected to become even more challenging in heterogeneous packaging driven by high computing density requirements.

In addition to advanced packaging technology development, TSMC has been endeavored in CPI since it started offering customers bump service in year 2000. By synergy of system-on-chip (SoC) and packaging manufacturing experience, TSMC can assist customers optimizing product design via in-house modeling service and customizing test vehicle (TV) to early assess the manufacturability and reliability performance of designed packaging solution.

For better CPI coverage and controllability, TSMC is strengthening the collaboration with substrate, memory, and materials suppliers in recent years via joint development projects or intense engineering interactions. Built on TSMC 3DFabric^® solutions, TSMC’s integrated turnkey service aims to provide customer total packaging solutions to further boost customer products’ time-to-volume and time-to-market.