ASICLAND
Overview
As a trusted TSMC VCA partner, ASICLAND provides comprehensive, end-to-end ASIC design and manufacturing services across a vast spectrum of technologies, ranging from 0.25 µm to 3 nm. We are dedicated to transforming complex architectural concepts into high-performance silicon solutions. Customers benefit from our disciplined manufacturing workflows and robust supply chain management. Our turnkey services encompass every critical stage—from initial design and verification to complex foundry coordination, advanced packaging, and qualification testing.
With a proven track record of successful tape-outs across diverse sectors, including AI, connectivity, automotive, and memory-related applications, ASICLAND provides the technical depth and operational reliability needed to ensure a predictable development path. Based on our proven experience and deep understanding of TSMC’s ecosystem, we focus on reducing technical risks and shortening the Time-to-Silicon, ensuring that your products reach the global market on schedule and at peak performance.
ASICLAND Solutions
Spec-in services
- Architecture & system definition
- Chip performance, functionality, and system architecture
- Power, safety, and scalability considerations
Front-end & Back-end Design
- RTL implementation and optimization
- RTL to GDS flow
- Logic synthesis and STA
- DFT (BIST, BIRA, etc.)
- Place & Route and layout verification
- Low power design methodology
Foundry Tape out Service
- MPW and single-mask projects through TSMC
- Yield monitoring and improvement
- Supply chain and logistics management
Packaging, Test & Reliability
- Package design and analysis
- Signal integrity and power integrity analysis
- Advanced packaging (2.5D, 3D)
- Test hardware and test program setup
- Reliability and product qualification
- Failure analysis and RMA support