Global UniChip Corp.
Overview
GLOBAL UNICHIP CORP. (GUC) is a market leader in advanced ASIC (application-specific integrated circuit) services. GUC’s comprehensive design services include ‘spec-in’ and SoC (System-on-Chip) integration, physical implementation, advanced packaging technologies, turn-key manufacturing, as well as cutting-edge IPs such as HBM, UCIe, and GLink-3D for die-on-die stacking.
GUC leads the ASIC service market in the AI (artificial intelligence), HPC (high-performance computing), Networking, SSD (solid-state drive), industrial and several other segments. GUC is committed to expertly delivering to customers the most competitive PPA (power, performance, and area) designs, promising quality and yield. GUC also dedicates itself to differentiating company’s ASIC products in the highly competitive market through engineering excellence.
TSMC is GUC’s sole foundry supplier as well as the closest partner in advanced process and packaging technologies. Relying on the close relationship with TSMC, GUC is able to conquer various design to manufacturing challenges in order to create excellence in everything they produce.
Based in Hsinchu, Taiwan, GUC has a global reputation with presence in North America, Mainland China, Europe, Korea, Japan and Vietnam. GUC is publicly listed on the Taiwan Stock Exchange (TWSE) under the ticker number “3443”.
GUC's Advanced ASIC Services
- Advanced Packaging Technology (APT) Design and Production Service
- Interposer Design and Production Service for CoWoS, InFO, SoW-X and SoIC
- SI / PI / Thermal and Mechanical Design and Simulation
- Substrate and Package Design
- Industry-leading HBM Controller and PHY IP
- Industry-leading Die-to-die IP : UCIe and GLink-2.5D
- Industry-leading Die-on-die IP : UCIe / GLink-3D
- Co-Packaged Optics (CPO) Design and Production Service
- Electrical Integrated Circuits (EIC) Implementation and Integration
- Photonic Integrated Circuits (PIC) Integration
- SI / PI / Thermal and Mechanical Design and Simulation
- Tape-out, Packaging and Production Services
- SoC Integration
- ARM / CPU Subsystem Integration
- IP Customization
- Domain IP Integration
- SoC Architecture Design and Implementation
- Implementation Methodologies
- Advanced Processes – 5 / 3 / 2nm and Sub-nanometer Technologies
- High Gate-count, Large-power ASIC Design
- Extra Large Scale Chip Design Methodology
- PPA Optimization
- Design for Test (DFT)
- Design for Manufacturing (DFM)
- Integrated Manufacturing
- Package Engineering
- Test and Product Engineering
- System Level Test (SLT)
- Quality and Reliability Engineering
- Supply Chain Management