IC-Link by imec
Overview
IC-Link by imec delivers customized solutions for innovative chip manufacturing, leveraging the expertise and ecosystem of imec, a world-leading research and innovation center for nanoelectronics and digital technologies.
IC-Link enables scalable and reliable ASIC development and manufacturing, with design expertise for the most advanced commercial nodes. Its excellent first-time-right record and established design flow provides customers with the confidence needed for the development of their ASICs.
IC-Link’s innovative sub-system reference design gives AI/HPC customers a head start in their leading node development. Through strategic partnerships with leading IP providers, IC-Link enables streamlined access to customers in markets including data- and telecom, industrial, fintech and medtech. Engagement models go from spec-in to netlist and GDS2 handoff, with more flexible services also available.
IC-Link's 2.5D and 3D advanced packaging offering includes silicon interposer and organic substrates, from ASIC co-design through manufacturing. In addition to this, its in-house capabilities cover engineering of volume testing, characterization and qualification services.
Growing to high-volume production is seamless with its supply chain management expertise. Customers can benefit from optimized yield management, a single point of contact for all logistics, and aligned capacity planning designed to meet all inventory requirements.
Other IC-Link services include volume production of silicon photonics chips with imec-developed state-of-the-art technology and custom wafer processing.
Architectural and RTL design
- Technology node selection, PPA/cost trade-off, IP selection, SoC architecture
- IP integration
- RTL design and functional verification
- Analog, mixed-signal and RF design
Physical design
- Advanced node down to N2
- Synthesis and full DFT
- Floor-planning, place and route, low-power hierarchical design, physical verification
- Analog custom layout
2D, 2.5D and 3D packaging
- Substrate, interposer, and package design
- Advanced packaging techniques for CoWoS, InFO and SoIC
- Signal and power integrity, thermal, mechanical analysis
Test development and qualification
- Internal ATE capabilities for production test development
- Test optimization: test pattern review and conversion, and test-limit review/part-average testing
- Qualification: prime standards for automotive, aerospace, industrial, consumer and medical applications; prime test for environmental, mechanical, electrical accelerated lifetime tests and radiation
NPI and supply chain management
- Single point-of-contact
- From prototype to high volume
- Yield analysis and optimization