As the first packaging manufacturing fab deployed automation system in the world, automation is applied for 5 dimesons: Equipment Automation, Carrier and Container Standardization, MES-based Automated Material Handling System (AMHS), Real- Time Dispatching System, and Product Resume & Yield Analysis.

Taking advantage of TSMC wafer manufacturing excellence and expertise, Advanced Packaging Manufacturing has designed and innovated exclusive packaging MES based on the foundation of wafer-based manufacturing execution system. TSMC has designed diverse containers for frame wafer and die manufacturing operation and constructed 3 types of the container lord port. More than that, 4 different carriers can be transported simultaneously on the same rail and precisely arrive the destination following the MES and AMHS instruction.

In addition to the access to MES and the readiness of AMHS, the real-time dispatching system and integrated equipment automation also play the significant roles for fab automation. Coping with the complex packaging manufacturing processes due to various materials and diverse forms, TSMC has optimized the dispatching decision by directing pre‐staging, adjusting loading balance of equipment, carriers and labor, to increase tool utilization and efficiency.