In November 2013, TSMC became the first foundry to begin 16nm Fin Field Effect Transistor (FinFET) risk production. In addition, TSMC became the first foundry that produced the industry's first 16nm FinFET fully functional networking processor for its customer.
Following the success of its 16nm FinFET process, TSMC introduced the 16nm FinFET Plus (16FF+) process. 16FF+ quickly entered volume production in July 2015, thanks to its fast yield ramp and performance improvements.
Meanwhile,16FF+ technology began production for customer applications in the automotive industry in 2017.
TSMC also introduced a more cost-effective 16nm FinFET Compact Technology (16FFC),which entered production in the second quarter of 2016. This process maximizes die cost scaling by simultaneously incorporating optical shrink and process simplification. Furthermore, 12nm FinFET Compact Technology (12FFC) drives gate density to the maximum for which entered production in 2017.
TSMC's 16/12nm provides the best performance among the industry's 16/14nm offerings. Compared to TSMC's 20nm SoC process, 16/12nm is 50 % faster and consumes 60% less power at the same speed. It provides superior performance and power consumption advantage for next generation high-end mobile computing, network communication, consumer and automotive electronic applications.