TSMC’s 3nm technology (N3) will be another full node stride from our 5nm technology (N5), and offer the most advanced...
TSMC's 5nm Fin Field-Effect Transistor (FinFET) process technology is optimized for both mobile and high performance...
TSMC's 7nm Fin Field-Effect Transistor (FinFET) process technology provides the industry's most competitive logic density...
TSMC's 10nm Fin Field-Effect Transistor (FinFET) process provides the most competitive combination of performance, power, area...
In November 2013, TSMC became the first foundry to begin 16nm Fin Field Effect Transistor (FinFET) risk production...
In November 2013, TSMC became the first foundry to begin 16nm Fin Field Effect Transistor (FinFET) risk production. In addition, TSMC became the first foundry that produced the industry's first 16nm FinFET fully functional networking processor for its customer.
Following the success of its 16nm FinFET process, TSMC introduced the 16nm FinFET Plus (16FF+) process. 16FF+ quickly entered volume production in July 2015, thanks to its fast yield ramp and performance improvements.
Meanwhile,16FF+ technology began production for customer applications in the automotive industry in 2017.
TSMC also introduced a more cost-effective 16nm FinFET Compact Technology (16FFC),which entered production in the second quarter of 2016. This process maximizes die cost scaling by simultaneously incorporating optical shrink and process simplification. Furthermore, 12nm FinFET Compact Technology (12FFC) drives gate density to the maximum for which entered production in 2017.
TSMC's 16/12nm provides the best performance among the industry's 16/14nm offerings. Compared to TSMC's 20nm SoC process, 16/12nm is 50 % faster and consumes 60% less power at the same speed. It provides superior performance and power consumption advantage for next generation high-end mobile computing, network communication, consumer and automotive electronic applications.
TSMC became the world's first semiconductor company that begins 20nm volume production, using its innovative double patterning...
22nm ultra-low power (22ULP) technology was developed based on TSMC's industry-leading 28nm technology and completed all process...
TSMC became the first foundry to provide the world's first 28nm General Purpose process technology in 2011 and has been adding...
TSMC became the first foundry to mass produce a variety of products for multiple customers using its 40nm process...
TSMC became the first foundry to begin 65nm risk production in 2005 and passed product certification the following year...
TSMC became the first semiconductor company to produce fully-functional 90nm chips using immersion lithography...
TSMC launched the semiconductor industry's first 0.13-micron (µm) low-k, copper system-on-a-chip (SoC) process technology...
TSMC offered the world's first 0.18-micron (µm) low power process technology in 1998. The Company continued to build...
TSMC has persistently maintained a “building in-house R&D” strategy since its founding in 1987, which has given the company...