TSMC has always insisted on building a strong, in-house R&D capability. As a global semiconductor technology leader, TSMC provides the most advanced and comprehensive portfolio of dedicated foundry process technologies.
-
3nm Technology
In 2022, TSMC led the foundry to start 3nm FinFET (N3) technology high volume production. TSMC’s 3nm process is the industry’s most advanced semiconductor technology...
-
5nm Technology
In 2020, TSMC led the foundry to start 5nm FinFET (N5) technology volume production to enable customers’ innovations...
-
7nm Technology
In 2018, TSMC became the first foundry to start 7nm FinFET (N7) volume production. The N7 technology is one of TSMC’s fastest time-to-volume nodes...
-
10nm Technology
TSMC's 10nm Fin Field-Effect Transistor (FinFET) process provides the most competitive combination of performance, power, area...
-
16/12nm Technology
In November 2013, TSMC became the first foundry to begin 16nm Fin Field Effect Transistor (FinFET) risk production...
-
20nm Technology
TSMC became the world's first semiconductor company that begins 20nm volume production, using its innovative double patterning...
-
22nm Technology
22nm ultra-low power (22ULP) technology was developed based on TSMC's industry-leading 28nm technology and completed all process...
22nm ultra-low power (22ULP) technology was developed based on TSMC's industry-leading 28nm technology and completed all process qualifications in the fourth quarter of 2018. Compared to 28nm high-performance compact (28HPC) technology, 22ULP provides 10% area reduction with more than 30% speed gain or more than 30% power reduction for applications including image processing, digital TVs, set-top boxes, smartphones and consumer products.
22nm ultra-low leakage (22ULL) technology development was completed and entered risk production in fourth quarter of 2018 to support IoT and wearable devices applications. New ULL device and ULL SRAM (static random access memory) can provide lower power consumption compared to 40ULP and 55ULP solutions.
-
28nm Technology
TSMC became the first foundry to provide the world's first 28nm General Purpose process technology in 2011 and has been adding...
-
40nm Technology
TSMC became the first foundry to mass produce a variety of products for multiple customers using its 40nm process...
-
65nm Technology
TSMC became the first foundry to begin 65nm risk production in 2005 and passed product certification the following year...
-
90nm Technology
TSMC became the first semiconductor company to produce fully-functional 90nm chips using immersion lithography...
-
0.13-micron Technology
TSMC launched the semiconductor industry's first 0.13-micron (µm) low-k, copper system-on-a-chip (SoC) process technology...
-
0.18-micron Technology
TSMC offered the world's first 0.18-micron (µm) low power process technology in 1998. The Company continued to build...
-
3-micron Technology
TSMC has persistently maintained a “building in-house R&D” strategy since its founding in 1987, which has given the company...
