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TSMC provides foundry’s most advanced Embedded DRAM process technologies. All TSMC Embedded DRAM processes are fully compatible with their standard logic counterparts, allowing customers to integrate DRAM memory and logic circuits on a single chip.

TSMC’s Embedded DRAM technology covers nodes ranging from 90nm to 40nm. The processes outrun conventional external DRAM with faster access speeds, offer a larger memory bandwidth, provide low power consumption, and feature a smaller footprint. They are ideal for applications SoCs for DTV (requiring high bus flow SoCs), network devices, cell stations, disk drive chips, electronic game machines and palmtop and mini consumer electronics (requiring low power consumption).
TSMC Reports Fourth Quarter EPS of NT$3.86(2019/01/17)
TSMC December 2018 Revenue Report(2019/01/10)
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