TSMC has always insisted on building a strong, in-house R&D capability. As a global semiconductor technology leader, TSMC provides the most advanced and comprehensive portfolio of dedicated foundry process technologies.
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A16 Technology
TSMC A16™ technology is the next nanosheet-based technology featuring Super Power Rail, or SPR. SPR is an innovative, best-in-class backside power delivery solution. It improves logic density and performance...
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2nm Technology
TSMC 2nm (N2) technology development is on track and made good progress. N2 technology features the company’s first generation of nanosheet transistor technology with full-node strides in performance...
TSMC 2nm (N2) technology development is on track and made good progress. N2 technology features the company’s first generation of nanosheet transistor technology with full-node strides in performance and power consumption. Volume production is expected in 2025.
Major customers completed 2nm IP design and started silicon validation. TSMC also developed low resistance RDL (redistribution layer), super high performance metal-insulator-metal (MiM) capacitors to further boost performance.
TSMC N2 technology will be the most advanced technology in the semiconductor industry in both density and energy efficiency, when it is introduced in 2025. N2 technology, with leading nanosheet transistor structure will deliver full-node performance and power benefits, to address the increasing need for energy-efficient computing. With our strategy of continuous enhancements, N2 and its derivatives will further extend our technology leadership well into the future.
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3nm Technology
In 2022, TSMC led the foundry to start 3nm FinFET (N3) technology high volume production. TSMC’s 3nm process is the industry’s most advanced semiconductor technology...
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5nm Technology
In 2020, TSMC led the foundry to start 5nm FinFET (N5) technology volume production to enable customers’ innovations...
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7nm Technology
In 2018, TSMC led the foundry to start 7nm FinFET (N7) volume production. N7 technology is one of TSMC’s fastest technologies...
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16/12nm Technology
In November 2013, TSMC became the first foundry to begin 16nm Fin Field Effect Transistor (FinFET) risk production...
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20nm Technology
TSMC became the world’s first semiconductor company that began 20nm volume production, using its innovative double patterning...
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22nm Technology
22nm ultra-low power (22ULP) technology was developed based on TSMC's industry-leading 28nm technology and completed all process...
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28nm Technology
In 2011, TSMC became the first foundry that provided 28nm General Purpose process technology. Following this, TSMC continued to...
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40nm Technology
TSMC led the foundry segment to start the volume production of a variety of products for multiple customers...
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65nm Technology
TSMC became the first foundry to begin 65nm risk production in 2005 and passed product certification the following year...
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90nm Technology
TSMC became the first semiconductor company to produce fully-functional 90nm chips using immersion lithography technology...
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0.13-micron Technology
TSMC launched the semiconductor industry's first 0.13-micron (µm) low-k, copper system-on-a-chip (SoC) process technology...
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0.18-micron Technology
TSMC offered the world's first 0.18-micron (µm) low power process technology in 1998. The Company continued to build...
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3-micron Technology
TSMC has persistently maintained a “building in-house R&D” strategy since its founding in 1987, which has given the company...
