TSMC introduced the world's first Sensor SoC process technology in 2011. This technology manufactures...
TSMC introduced the world's first Sensor SoC process technology in 2011. This technology manufactures monolithic Micro Electro Mechanical Systems (MEMS) by integrating TSMC's industry-leading Complementary Metal-Oxide-Semiconductor (CMOS) and wafer stacking technologies.
TSMC Sensor SoC technology ranges from 0.5-micron (µm) to 0.11µm and supports applications including G-Sensors, gyroscopes, pressure gauges, microfluidic, and biological gene chips.
In 2018, TSMC successfully delivered the world's first CMOS-MEMS (Micro-electromechanical Systems) monolithic capacitive barometer, which features sensitivity to altitude changes as small as 5 cm and fits in a package of slightly less than 1 mm2, for various system applications, including personal activity tracking and indoor navigation.
Future plans include the development of next-generation high-sensitivity thin microphone, MEMS Si-pillar TSV (through silicon via) technology.
CMOS Image Sensor
TSMC’s CIS technology has completed the evolution from Front side illumination (FSI) to Back side illumination (BSI) to multiple wafer stacking...
Non-Volatile Memory (NVM) includes the industry common One-Time-Programmable memory (OTP)...
TSMC provides foundry's most advanced and comprehensive portfolio of Mixed Signal/RF CMOS (MS/RF) technology...
TSMC provides foundry's most competitive and cost-effective analog process technology portfolio...
TSMC provides foundry's most competitive High Voltage (HV) technology portfolio. TSMC's HV processes range...
TSMC provides foundry's most comprehensive and competitive Bipolar-CMOS-DMOS (BCD)...
TSMC’s industry-leading ultra-low power (ULP) technologies offer ultra-low leakage (ULL) core devices, ULL SRAM and low operating voltage (low Vdd) solutions...