Background
Nurturing young and outstanding high-tech talents has always been one of TSMC’s talent incubation goals. Thus, TSMC offers various scholarships to encourage students to achieve their education goals and realize their dreams. Since 2022, we cooperated with National Yang Ming Chiao Tung University (NYCU) to launch out an elite scholarship program to support students from Singapore, Malaysia, Vietnam, and Indonesia to pursue Master's degree in the Semiconductor fields in Taiwan. This program not only offers comprehensive trainings for students to enhance their professional knowledge and research capabilities in semiconductor-related subjects but also provide internship opportunities at TSMC to gain valuable industry experiences for future career developments.
Admission Criteria: Spring 2024 (Enrolled in February)
Eligibility
- Undergraduate students from the universities in Vietnam, Indonesia, Singapore & Malaysia
- Major in Electronic Engineering, Physics, Material Science and Engineering, Chemistry, Chemical Engineering, and Mechanical Engineering with outstanding academic records
- Research focuses on semiconductor manufacturing, including semiconductor module process, device integration, and advanced packaging
- Demonstrate proof of Chinese Language Proficiency (TOCFL) Level 1 or equivalent certificate before starting the second semester after enrollment
Scholarship Package
- NT15,000 per month (up to two years) provided by TSMC
- Tuition reduction by NYCU
- Prioritized for internship (extra stipend) & recruitment opportunities in TSMC
Application Deadline: 9/30/2023
How to Apply: Please visit NYCU Office of International Affairs for more information or contact Fei-Chin Chang, feichin@nycu.edu.tw