Dr. C. C. Wei is Chairman and Chief Executive Officer of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to this appointment, Dr. Wei was TSMC's Chief Executive Officer from June 2018 to June 2024, and TSMC’s Board of Directors elected Dr. Wei as Chairman and Chief Executive Officer in June of 2024. Dr. Wei was President and Co-CEO from November 2013 to June 2018, and Co-Chief Operating Officer from March 2012 to November 2013. From 2009 to 2012, he was TSMC's Senior Vice President of Business Development. Before that, Dr. Wei was Senior Vice President of Mainstream Technology Business.

Before joining TSMC in 1998, Dr. Wei had served as Senior Vice President of Technology at Chartered Semiconductor and Senior Manager, Logic and SRAM technology development at ST Microelectronics. Prior to that, he was a Member of Technical Staff at Texas Instruments R&D organization.

C. C. Wei received his B.S. degree in electrical engineering from National Chiao Tung University and Ph.D. from Yale University.

Mr. Y.P. Chyn is Executive Vice President and Co-Chief Operating Officer at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He is responsible for the operation and management of all fabs in Taiwan and overseas. Prior to his promotion to Senior Vice President in 2016, he served as Vice President of Operations for Product Development. Before assuming that post, he was Vice President of Advanced Technology Business in TSMC, sharing responsibility for TSMC's advanced technology and 300mm fab operations.

Mr. Chyn joined TSMC when it was founded in 1987 and has made significant contribution to the Company's product engineering capabilities throughout his career. He was Director of Fab 1 from 1997 to 1998, and in later positions supported yield improvement in all new generations of advanced technology, including the 28nm, 16nm, and 7nm nodes. Mr. Chyn also manages sub-nodes including N22 and N12, as well as development of specialty technologies such as radio frequency, high voltage, and image sensors. Mr. Chyn pioneered the development of TSMC's Golden Spice Modeling methodology and Design for Manufacturing program.

Prior to joining TSMC, Mr. Chyn served as an engineer with the Industrial Technology Research Institute's Electronics Research and Service Organization (ERSO-ITRI).

Mr. Chyn earned his B.S. and M.S. degrees in Electrical Engineering from National Cheng Kung University.

Dr. Y.J. Mii is Executive Vice President and Co-Chief Operating Officer at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Dr. Mii joined TSMC in 1994 as a manager at Fab 3 and then joined the company's R&D organization in 2001. In 2011, Dr. Mii was appointed Vice President of Research and Development and later he was promoted to Senior Vice President in November 2016.

In more than two decades of services at TSMC, Dr. Mii has contributed greatly to the development and manufacturing of advanced CMOS technologies in both Fab Operations and R&D. He successfully managed the development of 90nm, 40nm and 28nm technologies. By spearheading the research and development of 16nm, 7nm, 5nm, 3nm, and beyond, he has helped maintain TSMC's technology leadership in the foundry segment of the global semiconductor industry.

Dr. Mii received the IEEE Frederik Philips Award in 2022, recognizing his outstanding accomplishments in the management of research and development. Before joining TSMC, Dr. Mii was a research staff member at IBM Research Center.

Dr. Mii has 34 patents globally, including 25 US patents, and holds a B.S. in electrical engineering from National Taiwan University, as well as an M.S. and Ph.D. in Electrical Engineering from the University of California, Los Angeles (UCLA).

Dr. Cliff Hou is Senior Vice President, Deputy Co-COO and Chief Information Security Officer at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He is also deputy of Mr. Y.P. Chyn. Prior to this post, Dr. Hou was TSMC's Vice President of Design and Technology Platform from August 2011 to July 2018 and later he served as Vice President of Technology Development in August 2018. He began his career at TSMC in 1997 and has since played a key role in the Company's design technology and ecosystem development.

From 1997 to 2007, Dr. Hou established the company's technology design kit and reference flow development organizations. Over the last decade, Dr. Hou led the development of TSMC's Open Innovation Platform® (OIP), which is now the most comprehensive design ecosystem in the global semiconductor industry.

Dr. Hou received the National Manager Excellence Award in 2010 as a pioneer in reference flows and design for manufacturing (DFM) that significantly lowers IC design barriers. He led the Company's OIP project team to win the first National Industry Innovation Award in 2011, presented by the Taiwan Ministry of Economic Affairs (MOEA).

Prior to joining TSMC, Dr. Hou was a section manager specializing in design environment at the Computer & Communications Research Laboratories, Industrial Technology Research Institute (ITRI/CCL) in Taiwan. He also served as an Associate Professor at Kaohsiung Polytechnic Institute (now known as I-Shou University) in Taiwan.

Dr. Hou holds 44 U.S. Patents and serves as a member of Board of Directors in Global Unichip Corp. He received B.S. degree in Control Engineering from Taiwan's National Chiao-Tung University, and Ph.D. in Electrical and Computer Engineering from Syracuse University.

Dr. Kevin Zhang currently serves as Deputy Co-COO and Senior Vice President of Business Development and Global Sales at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), where he is responsible to the companywide business strategy and global sales, including technology roadmap and customer engagement. Before joining TSMC, Dr. Zhang was Vice President of Technology and Manufacturing Group and Director of Circuit Technology at Intel. Dr. Zhang was elected as Intel Fellow in 2005 and led his teams to win 5 Intel Achievement Awards, the highest technical accomplishments at the company.

Dr. Zhang has published more than 80 papers at international conferences and in technical journals. He holds 55 U.S. patents in the field of integrated circuit technology. Dr. Zhang was the 2016 International Solid-State Circuit Conference (ISSCC) Program chair and conference chair for 2021/2022. He currently serves on the Advisory Board of MIT Engineering School. Dr. Zhang is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE).

Zhang holds a Ph.D. degree in Electrical Engineering from Duke University, North Carolina, USA.

Ms. Sylvia Fang has served as Vice President and General Counsel at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) since August, 2014. Previously, she had served as the Company's Associate General Counsel. Since Ms. Fang joined TSMC in 1995, she has worked on numerous high-profile corporate transactions, precedent-setting intellectual property and trade secret litigation, the promotion of significant legal changes, and the resolution of corporate governance issues. The Board of Directors has also appointed Ms. Fang as the Corporate Governance Officer and Board Secretary of TSMC, responsible for Board, Audit Committee, Compensation Committee and Shareholders’ meeting related matters.

Ms. Fang jointly founded the Taiwan Association for Trade Secrets Protection (TTSP) in 2015, and served as its Chairman for the first two terms to help promote legal reform of Taiwan's trade secret laws and regulations.

Prior to her career at TSMC, Ms. Fang worked at one of Taiwan's leading boutique intellectual property law firms, TIPLO, where she developed her expertise on general corporate and IP issues.

Ms. Fang's achievements are also widely recognized by the global legal community. In 2005, Asialaw magazine awarded her the “Deep & Far Award for Taiwan In-House Counsel”. She has also cultivated relationships with key government, trade, commerce and securities administrative agencies through her years of promoting important legal changes.

Ms. Fang is an attorney admitted in Taiwan having received her LL.B. degree from National Taiwan University, and her M.C.L. degree from College of Law, University of Iowa.

Mr. Wendell Huang is the Chief Financial Officer and Spokesperson of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).

Mr. Huang joined TSMC in 1999 and has led a number of significant corporate level finance projects, such as the acquisitions of TASMC and WSMC, the sale of Philips' shares in TSMC to institutional investors, and a series of major bond issues in 2010-2013. In his past two decades of service at TSMC, Mr. Huang has been responsible for the management of the Finance Division including Investment Management, Financial Planning, SEC Compliance, Customer Credit, Foreign Exchange Management, Financial Risk Management, and Funding & Cashier. He was appointed Deputy Chief Financial Officer in January 2019.

Prior to joining TSMC, Mr. Wendell Huang worked for ING Barings, Chase Manhattan Bank, Bankers Trust Company, Chemical Bank, and Bank of Boston. Mr. Huang has more than 30 years of working experience in the field of finance.

Mr. Wendell Huang received his B.B.A degree in Statistics from the National Chengchi University and his MBA degree from Cornell University.

Dr. T.S. Chang is Senior Vice President of Operations at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Dr. Chang joined TSMC in 1995 and was previously Senior Director of Fab12B. With more than 20 years of practical experience in the Operations Organization where he participated in technology development and manufacturing of Fab 1, Fab 4, Fab 8, Fab 12, and Fab 14, Dr. Chang is a key person to successfully transferring TSMC's leading-edge technology into production.

Dr. Chang was elected as a TSMC fellow in 2013, and was elected as a TSMC senior fellow in 2025, demonstrating his commitment to innovation and engineering excellence. He has 52 patents globally and about half of them are U.S. patents.

Dr. Chang received his B.S. degree in Electrical Engineering; M.S. degree in Electrical Engineering and Ph.D. in Electrical Engineering, all from National Tsing Hua University.

Dr. Michael Wu is Senior Vice President of Technology Development at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He is currently in charge of A14 platform technology development. Dr. Wu joined TSMC R&D in 1996 and has since participated in advanced CMOS technology development from 0.13um, 90nm, 65nm to 28nm, and successfully developed and delivered 28nm low power, 16nm, 7nm and 3nm technologies.

Dr. Wu has received multiple recognitions including the National Industrial Innovation Award – Innovative Trailblazer of the Year in 2013, the National Management Excellence Award in 2015, and the Chinese Outstanding Engineer Award in 2017.

Dr. Wu served in several positions in the Executive Committee of the International Electron Devices Meeting (IEDM) from 2013 to 2016, and was Technical Program Chair and General Chair of VLSI-TSA in 2017 and 2018, respectively. Dr. Wu was inducted as a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) for his leadership in CMOS process integration. He has published 52 papers and holds a total of 72 patents in the field of semiconductor technology.

Dr. Wu received his B.S. degree in Electrical Engineering from National Cheng Kung University and both his M.S. degree and Ph.D. in Electrical Engineering from University of Wisconsin-Madison. He also received an EMBA degree in the Institute of Technology Management from National Tsing Hua University.

Mr. Jonathan Lee is Senior Vice President of Corporate Planning Organization at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for operation resources planning and strategic planning.

Prior to this role, Mr. Lee was Vice President of TSMC’s Corporate Planning Organization from June 2021, and Senior Director of TSMC’s Strategic Planning Division between May and June of 2021. Mr. Lee began his career at TSMC in 2007, and has served in a variety of strategic finance positions in the Company. From 2007 to 2010, Mr. Lee was controller of TSMC’s Mainstream Technology Business, Advanced Technology Business, and Research & Development, leading a number of significant corporate business development and investment projects such as specialty technologies and capacity expansion of TSMC’s Shanghai 8-inch fab. Mr. Lee became Senior Director of Finance Business Development in February of 2012, and had since been supporting TSMC’s success by conducting several strategic projects for capacity expansion including the establishment of TSMC Nanjing 12-inch fab in 2017, TSMC Arizona 12-inch fab in 2020, TSMC Japan 3DIC R&D Center and Japan Advanced Semiconductor Manufacturing Inc. (JASM) in 2021, and European Semiconductor Manufacturing Corporation (ESMC) in 2023.

Prior to joining TSMC, Mr. Lee was the President for Biomorphic Microsystem Corporation, and Finance Director in Macronix International Co. Ltd. Mr. Lee has more than 25 years of working experience in the field of semiconductor and finance.

Mr. Lee received his B.S. degree in Chemistry from Chung Yuan Christian University in Taiwan, and his MBA degree from Baruch College, City University of New York.

Dr. Min Cao is Vice President of Pathfinding and Corporate Research under the Research and Development (R&D) and Chief Technology Officer at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Previously, Dr. Cao had served as Senior Director of TSMC's Pathfinding Division from 2016. Dr. Cao began his career at TSMC in 2002, and has successfully helped develop multiple generations of advanced CMOS technology including N90, N65, N40, N28, N20, and N10.

From 2006 to 2008, Dr. Cao led the development of N40G, TSMC's first technology node utilizing super density scaling. In 2009, he led the development of N28HP, the company's first node utilizing HKMG technology. Dr. Cao later led his team to develop N20, winning the Taiwan Ministry of Economic Affairs' National Industry Innovation Award in 2013. He also led the development of N10 from 2014 to 2016.

Prior to joining TSMC, Dr. Cao worked at Hewlett-Packard Laboratories from 1994 to 1999, PDF Solutions from 1999 to 2000, and Pericom Semiconductor from 2000 to 2002.

Dr. Cao holds a total of 36 patents in the field of integrated circuit technology. He has served on many conference committees, including IEDM and the Symposia on VLSI Technology and Circuits. Dr. Cao received his B.S. degree in Electronic Engineering from Fudan University in Shanghai, M.S. degree in Physics from San Francisco State University, and his Ph.D. degree in Physics from Stanford University.

Y.H. Liaw is Vice President of Fab Operations II at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Since joining TSMC in 1988, Mr. Liaw has accumulated operations experience serving in a variety of engineering and management positions in the Company’s fabs, including director of Fab 5, Fab 8, Fab 15A and Fab 15B.

As Director of Fab 15A, he successfully led the volume production of 28 nanometer technology with innovations in cross-organizational collaboration including the “Super Manufacturing Platform” which enabled smooth technology transfer from R&D to manufacturing, and the “Central Setup Team” which enabled a record-breaking production ramp. For his efforts, he received the R.O.C. National Management Excellence Award as well as the TSMC Medal of Honor in 2013.

As Director of Fab 15B, he started out with 10 nanometer technology in 2017 and migrated to 7 nanometer technology in 2018, establishing TSMC as the first company for 7 nanometer technology mass production in the world.

Mr. Liaw received his B.S. and M.S. degrees in Chemical Engineering from National Tsing Hua University.

Dr. Simon Jang is Vice President of Advanced Tool and Module Development of Technology Development under the Research and Development (R&D) at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Prior to this appointment, Dr. Jang served as Senior Director of the Advanced Tool and Module Development Division. Dr. Jang joined TSMC in 1993 and has since been responsible for managing advanced module technology development, including tool and material evaluation and selection, for critical semiconductor production modules.

In his early tenure with TSMC, Dr. Jang held many different positions in the company's research and development function, covering a wide spectrum of module technology. Dr. Jang was Director of Advanced Etch, BEOL (Back end of line) Module, and Platform Module. Under his leadership, the Advanced Module team consistently developed and delivered critical modules for advanced N28/N20/N16/N10/N7/N5 technologies. Dr. Jang was also one of the key contributors for breakthroughs in self-aligned contact formation and FinFET transistor and advanced interconnect fabrication. Dr. Jang has received more than 320 U.S. patents and published 147 papers in semiconductor technology.

Dr. Jang received the “National Industrial Innovation Award” and “National Outstanding Manager Award” in 2019 and 2011, respectively. Before joining TSMC, Dr. Jang was a project research assistant at Microsystems Technology Laboratories, MIT.

Dr. Jang received both his B.S. degree and M.S. degree in Materials Science & Engineering from National Tsing Hua University, and his Ph.D. in Materials Science & Engineering from Massachusetts Institute of Technology.

Dr. C.S. Yoo is Vice President of Specialty at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for strategic planning, project management, and customer services of TSMC’s strategic customer program. Prior to this post, Dr. Yoo was Senior Director of TSMC’s Office of Strategy Customer Program in May of 2019. Since joining TSMC in 1988, Dr. Yoo has served in a variety of manufacturing and research & development positions in the Company. From 1991 to 1995, Dr. Yoo was an SRAM program manager, successfully developing and delivering 0.65um, 0.55um, 0.5um, 0.45um, and 0.35um technologies while introducing the triple poly technology to 0.35um to significantly increase the number of gross die per wafer. Dr. Yoo was then promoted to be Deputy Director of the SRAM/DRAM and embedded DRAM Program. In 1996, Dr. Yoo delivered 0.35um DRAM into production. In 1997 he joined the E-Beam Operation (EBO) Division and successfully led the team to deliver masks for key technologies from 0.18um to 5nm. In 2016, he developed customized robots and an auto-particle inspection system to enhance automation. 

With more than three decades of practical experience in semiconductor operations management, Dr. Yoo received the “National Manager Excellence Award” in 2008, recognizing his achievement in developing the world’s most advanced mask technology. In 2017, Dr. Yoo led the EBO team to successfully deliver EUV reticles and pellicles, helping TSMC to introduce EUV into production. 

In 1979, Dr. Yoo graduated with a degree in Chemical Engineering from the National Taipei Institute of Technology (Now the National Taipei University of Technology), and was certified as a professional chemical engineer in the same year. Dr. Yoo then received an M.S. degree and Ph.D. in Chemical Engineering from the Worcester Polytechnic Institute, U.S.A.
 

Dr. Jun He is Vice President of Advanced Packaging Technology and Service at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). His responsibility spans across TSMC foundry eco-system and the Company’s backend business and operations management, such as incoming materials qualification, reliability and certification of new process technology & design IP, manufacturing quality as well as enabling customers for their product qualification and ramp. Prior to this role, Dr. He was Senior Director of Advanced Technology Quality & Reliability Division at TSMC. Since joining the Company in 2017, he has been leading the development of analytical and test methodology to effectively detect reliability defects and screen problematic products. Such innovations accelerated launch and steep production ramp for 7nm and 5nm technologies. Dr. He also revamped TSMC’s quality management system for incoming materials in 2019 and strengthened collaborative relationship with key suppliers.

Prior to joining TSMC, Dr. He was a senior director at Intel Corporation, leading overall quality and reliability of process technology development and manufacturing. His scope included research & development of Si, advanced packaging and test along with Intel worldwide manufacturing operations. Dr. He is a three-time winner of Intel Achievement Awards, the highest technical accomplishments at the company, for his technical leadership on low-k dielectric integration, assembly defect detection and development of advanced one-time programmable read-only memory.

Dr. He holds 36 patents globally, including 28 U.S. patents and published over 50 papers in international conferences and peer-reviewed technical journals. He received his B.S. degree in Physics and Ph.D. in Materials Science from University of California, Santa Barbara.

Dr. Chris Lin is Vice President and Chief Information Officer (CIO) of Corporate Information Technology at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). His responsibility spans across TSMC information technology, including intelligent manufacturing, high performance computing, digital supply chain, eCommerce, team collaboration, modernized workplace, and infrastructure re-engineering. Since joining the Company in 2021 as the CIO, Dr. Chris has been leading the IT team to accelerate TSMC digital transformation for the optimization of business process and fab production by adopting new technology such as AI and ML.

Dr. Lin has 30 years of diverse experience in the IT area, prior to joining TSMC, Dr. Lin was Vice President in Information Technology at Mozilla since 2018. He designed strategy and technology roadmap for transformation, and actively engaged in architecture design review, drove business infrastructure scalability with microservices and cloud native design. He became Director of Enterprise Platform Infrastructure at Facebook between 2016 and 2018, responsible for engineering and software-centric operations for computing platform, runtime, network, security, applications operations, data operations, and device operations for Facebook business.

Dr. Lin received Computerworld Premier 100 IT Leaders Award in 2015 and led his teams winning multiple Innovation Awards in IT industry through his career.

Dr. Lin received his B.S. in Electrical Engineering from National Taiwan University. He received his M.S. and Ph.D. both in Electrical Engineering and Computer Science from University of California at Berkeley.

Dr. Arthur Chuang is Vice President of Facility Division at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He is responsible for the planning, design, construction, and maintenance of new fabs, as well as the operation and upgrade of existing fab facilities. Dr. Chuang joined TSMC as an equipment engineer in 1989 and transitioned to facilities, dedicating himself to facilities duties for more than 25 years. Dr. Chuang successfully led the Facilities Division to meet the tight construction schedule of Fab 15B, TSMC Nanjing, and Fab 18A, and he engages in continuous efforts to enhance and integrate facility systems.

Dr. Arthur Chuang drives the Company’s green manufacturing initiatives, which includes climate change and energy management, water management, waste management, and air pollution control to achieve the Company’s ESG objectives. He is Director of the TSMC Charity Foundation, and has used his expertise to support related projects such as aiding in reconstruction from flooding caused by Typhoon Morakot in 2009, and from the Kaohsiung gas explosion in 2014, all of which helped TSMC to fulfill its corporate social responsibility.

Dr. Arthur Chuang is the Chairperson of the Steering Board in SEMI High-Tech Facility Committee from 2018. Dr. Chuang also serves as an adjunct professor-rank specialist at Department of Civil Engineering in National Taiwan University.

Dr. Chuang received the “Ten Outstanding Project Managers Award” in 2011 and the “National Industrial Innovation Award” in 2015. Prior to joining TSMC, Dr. Chuang served at Texas Instruments Taiwan as a Process Engineer.

Dr. Arthur Chuang received his B.S. degree in Mechanical Engineering from National Taiwan Institute of Technology（Now the National Taiwan University of Science and Technology）, and Ph.D. degree in Civil Engineering from National Taiwan University.

Dr. L.C. Lu is Vice President of Research & Development / Design & Technology Platform at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and a TSMC Senior Fellow. Dr. Lu is responsible for supporting design enablement to meet a wide range of requirements from the Company’s broad customer base. Prior to this role, he served as function head of Design and Technology Platform from 2018.

Since joining TSMC in 2000, Dr. Lu held a number of management roles related to design services. Dr. Lu collaborated with process RD to innovate Design and Technology Co-Optimization (DTCO) to enhance speed, power and density for TSMC’s new process technologies. He has worked closely with design ecosystem partners through the TSMC Open Innovation Platform^® (OIP) to provide comprehensive design solutions and IPs to enable high density, high performance, automotive, RF, 2.5D and 3D designs for different customer applications.

In 2012, Dr. Lu received Taiwan’s National Outstanding Manager Award and was elected as a TSMC Senior Fellow in 2025. He is one of TSMC’s most prolific inventors with more than 100 patents in the United States and other countries. 

Dr. Lu received his B.S. in Electrical Engineering from National Taiwan University, M.S. in Computer Science from National Tsing Hua University, and Ph.D. in Computer Science from Yale University. 

Mr. K.C. Hsu is Vice President of Integrated Interconnect & Packaging at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for the development of TSMC’s system integration technologies, including 3D IC and advanced packaging. Prior to this role, Mr. Hsu was Taiwan Country Manager for Micron Technology, responsible for the company’s overall operations in Taiwan including two manufacturing sites. Mr. Hsu also served as President of TSMC Washington, TSMC’s first fab in the United States, where he successfully improved performance to reach the corporate average. He possesses more than 30 years’ experience in the semiconductor industry and has a track record of proficiency at technology transfer and optimization, yield improvement, and increasing capacity at new fabs.

Mr. K.C. Hsu received his B.S. in Physics from National Taiwan University in 1986 and his M.S. in Technology Management from National Chiao Tung University in 1994.

Mr. Ray Chuang is Vice President of Fab Operations I at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Since joining TSMC in 1997, Mr. Chuang has served in a variety of production management positions at TSMC's fabs, and has successfully contributed to mass production of the Company's 90nm, 65nm, 40nm, 20nm, 16nm, 10nm, 7nm, and 5nm family process technologies. In 2020, Mr. Chuang was appointed as Senior Fab Director of Fab 18A and successfully led his team to produce the industry-leading N5 process technology, and then produced N4 process technology in 2022. TSMC has become the first company in the world to produce the 5nm family process technology, providing the most advanced and comprehensive technologies and services to the Company’s customers.

Prior to joining TSMC, Mr. Chuang worked for Vishay Siliconix and Intel respectively as senior engineer between 1989 and 1995. He was a project manager at TI-Acer from 1995 to 1997.

Mr. Chuang has more than three decades of practical experience in semiconductor operations management, and holds 52 patents globally, including 30 U.S. patents.

Mr. Chuang received his B.S. in Materials Science & Engineering from National Tsing Hua University, and dual M.S. degree in Materials Science & Engineering and Engineering Economics System from Stanford University.

Mr. P.H. Chen is Vice President of the Human Resources Organization at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Mr. P.H. Chen joined TSMC in 1990 and has more than 34 years of practical experience in Operations, Research and Development, the Corporate Planning Organization, and the Customer Program Office. His leadership in technology development and execution has enabled his team to consistently meet key milestones. As director of Fab 12B between 2010 and 2018, he led his team to work with RD to successfully transfer TSMC's leading-edge technology into production, including 40 nanometer, 28 nanometer, 20 nanometer, and 16 nanometer process technologies. While serving as director of Fab 14A from 2018 to 2020, he adopted technologies ranging from 0.13 micron to 40 nanometer to produce a broad range of specialty products, with a record monthly capacity of 300,000 wafers.

Mr. P.H. Chen was the senior director of the Customer Program Office from December 2020 and earned trust from customers with his service. He then later transferred to the Human Resources Organization as Senior Director prior to his current role.

Mr. P.H. Chen received the “National Outstanding Manager Award” in 2010. He also received the “Morris Chang Innovation Award” and the Medal of Honor in 2006 and 2013, respectively. Currently he has 25 patents globally including 14 U.S. patents.

Mr. P.H. Chen received his B.S. degree and M.S. degree in Chemistry from National Sun Yat-sun University.

Mr. Y.K. Hwang is Vice President of Materials Management at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), playing a pivotal role in optimizing TSMC's global supply chain and resource deployment. His responsibilities include ensuring continuous, efficient flow of materials, thereby supporting TSMC's operations, mitigating risks, and helping TSMC maintain its technology leadership. Additionally, Mr. Hwang serves as the chairperson of the TSMC ESG Committee and head of the Corporate Sustainability Office.

Mr. Hwang joined TSMC in 1995 and has held various leadership positions over the past 30 years. From 2024 to 2025, he served as the Quality and Reliability Organization. Previously, from 2017 to 2024, he led critical advanced process technology fabs, including Fab 18A/B and Fab 15B, where his teams established production sites for 7nm, 5nm, and 3nm process technologies, successfully achieving global-leading mass production.

Mr. Hwang holds 51 global patents to date, including 27 U.S. patents. In 2023, he received the “National Outstanding Manager Award”. Mr. Hwang received his Master of Business Administration (MBA) from the University of Texas at Arlington and Master's degree in control systems from West Virginia University Institute of Technology.

Mr. B.Z. Tien is Vice President of Advanced Technology Engineering at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), having been promoted to senior director of Fab 12B in January 2022. Since joining TSMC in 1998, he has focused on fab operations and the mass production of advanced process technologies.

As the leader of a TSMC GIGAFAB®, Mr. Tien plays a crucial role in the company's manufacturing excellence. Working closely with R&D organizations, he has overseen the mass production of TSMC's advanced logic process technologies, ranging from 28nm down to the leading-edge 2nm. He has made contributions in areas including productivity, quality, cost control, and supply chain management.

Mr. Tien has more than 25 years of semiconductor manufacturing operations experience. He also demonstrates sustainable governance, leading Fab 12B to five consecutive TSMC ESG AWARD for Outstanding Contributions.

Mr. Tien received his Bachelor's and Master's degrees in Electronics Engineering from National Chiao Tung University.

Dr. S.S. Lin is Vice President Research and Development at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), currently responsible for 10-angstrom platform technology development. Dr. Lin joined TSMC's R&D organization in 2000, focusing on semiconductor process technology integration. He has contributed to the development of advanced semiconductor process technologies including 90nm, 45/40nm, and 20nm, as well as completing the development of TSMC’s world-leading 10nm and 5nm FinFET process technologies. In addition, Dr. Lin successfully launched the industry’s most energy-efficient 2nm nanosheet transistor process technology, ensuring TSMC's leading position in advanced semiconductor technology innovation.

Dr. Lin has received numerous honors including the "Outstanding Young Engineer Award" in 2007, the "National Manager Excellence Award" in 2021, and the 8th "National Industrial Innovation Award – Innovative Trailblazer Team Award" in 2024.

Dr. Lin holds 55 patents globally, including 29 U.S. patents. He earned his Bachelor's, Master's, and Ph.D. degrees, all in electronic engineering, from National Chiao Tung University.

Dr. Lipen Yuan is Vice President of Business Development at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), responsible for integrating TSMC’s business strategy with its technology roadmap, as well as customer and ecosystem engagement. Prior to this post, he was Senior Director of Advanced Technology Business Development, in charge of TSMC’s advanced logic, HPC, packaging, and RF technology portfolio. Before joining the Business Development organization, Dr. Yuan served in a variety of roles in the Design and Technology Platform organization, where he was responsible for design-technology co-optimization (DTCO) of 7nm and 5nm technology and pathfinding of next-generation logic technologies after 5nm. Dr. Yuan has been instrumental in advancing TSMC’s leading position in advanced logic technology and developing win-win relationships with customers. His achievements were recognized with Taiwan’s National Outstanding Manager Award in 2023.

Prior to joining TSMC in 2011, he served at Synopsys Inc. (Mountain View, CA) where he was a Group Director of sign-off analysis products.

Dr. Yuan holds 32 patents globally, including 22 U.S. patents. He received his M.S. and Ph.D. in Electrical and Computer Engineering from University of Illinois at Urbana-Champaign and B.S. degree in Electrical Engineering from National Taiwan University, Taipei, Taiwan.

Sajiv Dalal is the President and Chief Executive Officer of TSMC North America, a wholly owned subsidiary of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), overseeing the Company’s operations, strategic planning, business management, and leadership in the region.

Prior to this appointment, Sajiv was the Executive Vice President of Business Development, where he led the strategic direction and execution of the Company’s business development and sales initiatives in North America. His focus was on cultivating relationships with major accounts, pursuing new ventures, and optimizing the Value Chain Alliance (VCA) and Design Center Alliance (DCA) sales channels to drive revenue growth and expand market share.

With over 40 years of expertise in the semiconductor industry, Sajiv Dalal has extensive experience in engineering, business development, and sales roles. Since joining TSMC in 1999 as Director of Account Management for North America, Sajiv has led several highly successful strategic initiatives, driving significant revenue and business growth in the region.    

Before joining TSMC, Sajiv served as Executive Director of Epson Electronics America’s Semiconductor Manufacturing Services and contributed to process technology development at National Semiconductor’s Programmable Products Group, where he held various management and engineering roles.

Mr. Dalal holds a Master of Business Administration (MBA) from Santa Clara University, a Master of Science in Chemical Engineering from Stanford University, and a Bachelor of Science in Chemical Engineering from Nagpur University, India.

Mr. Christopher Thomas is the President of TSMC Europe, a wholly owned subsidiary of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), overseeing the Company’s operations, strategic planning, business management, and leadership in the region.

Mr. Christopher Thomas joined TSMC in 2026. Prior to this appointment, Mr. Christopher Thomas was the founder and chairman of an advisory firm, Integrated Insights Ltd., and held several senior roles at Intel and McKinsey, respectively. Intel awarded him the Intel Achievement Award, the company’s highest honor, and McKinsey presented him with the Fred Gluck Award, the firm’s highest honor for knowledge development.

He was appointed as an Adjunct Professor at Tsinghua University, a Senior Fellow at the Brookings Institution, and an Advisory Board Member at the Atlantic Council. Chris also served on the Board of Directors for several listed and private companies.

Mr. Christopher Thomas received his Master of Business Administration (MBA) and M.A. in Political Science from Stanford University, and his B.S. in Economics from the Wharton School.

Makoto Onodera is Representative Director and President of TSMC Japan, a wholly owned subsidiary of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), and joined the Company in 1997. 

Prior to his career at TSMC, Makoto Onodera was Senior Marketing Engineer at Applied Materials Japan, Inc. where he was responsible for advanced Dielectric Chemical Vapor Deposition systems in various sales and marketing functions.

Makoto Onodera received his MBA degree from the George H. Atkinson Graduate School of Management at Willamette University.

Roger Luo is the President of TSMC China and TSMC Nanjing, both are wholly owned subsidiaries of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). He is responsible for TSMC’s business development in China and operations of the TSMC China and TSMC Nanjing subsidiaries.

Mr. Luo joined TSMC in 1994. He has served as business manager for the Asia Pacific region and the Head of Operations for TSMC Europe. Mr. Luo has been serving as the head of China sales region since 2003, the President of TSMC Nanjing since 2016, and the President of TSMC China since 2020. In these roles, Mr. Luo is responsible for TSMC’s operations and business development efforts in China, as well as supporting the long-term developmental needs of TSMC’s customers and industry partners.

Prior to joining TSMC, Mr. Luo worked as an IC designer for a decade with the Industrial Technology Research Institute’s Electronics Research and Service Organization (“ERSO-ITRI”) and the Twinhead Computer International Corporation. He has a total of over 35 years of work experience in various areas of the semiconductor industry.

Mr. Luo received his MBA degree from Peking University in Beijing, China, and his Bachelor of Science degree in Control Engineering from Taiwan Chiao-Tung University.