As advanced processes develop, integrated circuit linewidths continue to shrink, while diverse product portfolios deepen the challenges in process control. TSMC has tailored its manufacturing infrastructure to handle a diversified product portfolio that uses strict process control to meet tightened specs and higher product quality, performance and reliability requirements from customers. TSMC’s process control systems are integrated with numerous intelligent applications to achieve excellence in both quality and manufacturing. Through intelligent detection, smart diagnosis, and self-learning, it achieves the most stringent process control standards, thereby enabling TSMC to achieve remarkable results in yield improvement and quality control.

To meet stricter quality requirements, TSMC is implementing artificial intelligence (AI) technologies, and has developed systems for precise fault detection and classification system, intelligent advanced equipment control, and intelligent advanced process control to ensure the consistency of tool matching and process stability. Combining the foundry know-how, minimize the convergence of process variation through self-diagnosis and cognitive action. As a result, each chip can be precisely controlled at the nanometer level to produce the highest quality wafers for customers.

To continuously improve and expand, TSMC is extending its intelligent manufacturing system from the front-end fabs to the back-end fabs, establishing a complete process management chain from wafer to die packaging at each production stage. Simultaneously, this intelligent manufacturing system has also encompassed all global fabs to achieve comprehensive, consistent, and high-quality process management.