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22nm ultra-low power (22ULP) technology was developed based on TSMC’s industry-leading 28nm technology and completed all process qualifications in the fourth quarter of 2018. Compared to 28nm high-performance compact (28HPC) technology, 22ULP provides 10% area reduction with more than 30% speed gain or more than 30% power reduction for applications including image processing, digital TVs, set-top boxes, smartphones and consumer products.

22nm ultra-low leakage (22ULL) technology development was completed and entered risk production in fourth quarter of 2018 to support IoT and wearable devices applications. New ULL device and ULL SRAM (static random access memory) can provide lower power consumption compared to 40ULP and 55ULP solutions.



TSMC Reports First Quarter EPS of NT$2.37(2019/04/18)
   
TSMC Files Annual Report on Form 20-F for 2018(2019/04/17)
   
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