Power, Performance, Area (PPA) and Value Optimized

TSMC 16nm (N16) and 12nm (N12) process technologies enable 4K120 (120Hz high frame rate) digital TVs (DTVs), over-the-top (OTT) dongles, and set-top-boxes (STBs) products. Increased silicon content supports high-performance, low-power emerging applications, such as cloud gaming. The TSMC N16 process reduces cost while improving performance, power, and area (PPA).

The 12nm FinFET Compact Plus (12FFC+) process represents the latest advancement in TSMC's 16nm/12nm family. This enhanced technology provides a 5% increase in speed or a 10% reduction in power consumption compared to its predecessor, 12FFC. In addition, it incorporates several new features, such as support for low VDD (operating voltage), low-leakage devices, and low-leakage SRAMs, making it suitable for a wide range of applications.

TSMC also offer world-leading embedded resistive random-access memory (RRAM) technology in FinFET to fulfill customers’ needs. 12nm FinFET compact plus (12FFC+) embedded RRAM technology, featuring a balance of cost and performance, entered consumer-grade risk production in 2024.