TSMC advanced packaging services create the best solutions to unleash our customer's innovations by advancing the core technology, providing integrated turnkey services, and leveraging intelligent packaging fab.
3DFabric™ offers our customers the freedom and advantage to design their products more holistically as a system of mini-chips that offers key advantages versus designing a larger monolithic die. TSMC's 3DFabric™ consists of both frontend and backend technologies, including TSMC-SoIC® , CoWoS® and InFO.
Built on 3DFabric technologies, TSMC’s integrated turnkey service provides a complete solution to resolve heterogeneous packing issues, e.g. chip-packaging-integration (CPI ) issues, through intense collaboration with substrate, memory and materials suppliers. TSMC prominently reduce customers’ time-to-volume and time-to-market.
Leverage the big data from automation, TSMC achieved intelligent packaging fab through the application of deep learning and image recognition. The machine learning optimizes the manufacturing and reduces fab cycle time. Through advanced image recognition, TSMC establish quality defense and defect prevention systems to ensure the high quality.