TSMC advanced packaging services create the best solutions to unleash our customer's innovations by advancing the core technology, offering integrated turnkey services, leveraging intelligent packaging fab, and providing comprehensive testing solutions.

TSMC 3DFabric^® solutions offer our customers the freedom and advantage to design their products more holistically as a system of mini-chips that offers key advantages versus designing a larger monolithic die. TSMC 3DFabric^® solutions consist of both frontend and backend technologies, including TSMC-SoIC^®, CoWoS^®, and InFO.

Built on TSMC 3DFabric^® technologies, TSMC’s integrated turnkey service provides a complete solution to resolve heterogeneous packing issues, e.g., chip-packaging-integration (CPI) issues, through intense collaboration with substrate, memory and materials suppliers. TSMC prominently reduces customers’ time-to-volume and time-to-market.

Leverage the big data from automation, TSMC achieved intelligent packaging fab through the application of deep learning and image recognition. Machine learning optimizes the manufacturing and reduces fab cycle time. Through advanced image recognition, TSMC establishes quality defense and defect prevention systems to ensure high quality.

By utilizing TSMC's total testing solutions, including industry-leading probe card and thermal management technologies, we have established a test program development infrastructure. This enables co-development of test programs with customers to accelerate new product time-to-market. Furthermore, TSMC is advancing its vision for distributed in-process testing, which will be the cornerstone for 3DIC.