TSMC advanced packaging services create the best solutions to unleash our customer's innovations by advancing the core technology, providing integrated turnkey services, and leveraging intelligent packaging fab.

3DFabric™ offers our customers the freedom and advantage to design their products more holistically as a system of mini-chips that offers key advantages versus designing a larger monolithic die. TSMC's 3DFabric™ consists of both frontend and backend technologies, including TSMC-SoIC™ , CoWoS® and InFO.

Built on 3DFabric technologies, TSMC’s integrated turnkey service provides a complete solution to resolve heterogeneous packing issues, e.g. chip-packaging-integration (CPI ) issues, through intense collaboration with substrate, memory and materials suppliers. TSMC prominently reduce customers’ time-to-volume and time-to-market.

Leverage the big data from automation, TSMC achieved intelligent packaging fab through the application of deep learning and image recognition. The machine learning optimizes the manufacturing and reduces fab cycle time. Through advanced image recognition, TSMC establish quality defense and defect prevention systems to ensure the high quality.

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Innovative 3DFabric Technology
TSMC 3DFabric™ is the agglomeration of 3D Silicon Stacking and Advanced Packaging Technologies. TSMC has developed comprehensive advanced packaging technology solutions to meet or exceed customers’ requirement and fend off competition.
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Integrated Turnkey Service
TSMC integrated turnkey service provides end-to-end technical and logistical customized 3DPackage solutions. With TSMC silicon SoC technology, 3D technologies and collaborating with IP, substrate and memory suppliers...
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Intelligent Fab
Committed to manufacturing excellence, TSMC has moved to a new level of intelligent manufacturing including deep learning and image recognition, which widely applied in Advanced Packaging Manufacturing Fab...
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TSMC advanced packaging services create the best solutions to unleash our customer's innovations by advancing the core technology, providing integrated turnkey services, and leveraging intelligent packaging fab.

3DFabric™ offers our customers the freedom and advantage to design their products more holistically as a system of mini-chips that offers key advantages versus designing a larger monolithic die. TSMC's 3DFabric™ consists of both frontend and backend technologies, including TSMC-SoIC™ , CoWoS® and InFO.