TSMC provides foundry’s most comprehensive and competitive bipolar-CMOS-DMOS (BCD) power management process technologies and is the first foundry that brings BCD power management process technologies onto 12-inch wafer for production.

TSMC BCD power management process features higher integration, smaller footprint, and lower power consumption, covering nodes from 0.6µm to 40nm, helping customers deliver better power management ICs with more stable and efficient power supplies that consume less energy, ideal for applications including automotive, consumer electronics, communication devices, and computers.

TSMC continued to increase its 12-inch BCD technology competitiveness in 2023 by expanding its 0.13μm and 90nm BCD technology to meet the demand of the automotive market and server request. The logic baseline of second-generation 40nm BCD is fully compatible to ultra-low power (ULP) process, which also provides 5-28V high-voltage components, thereby enabling more power management chip applications.

In addition, TSMC is developing the world’s most advanced 22nm BCD platform to lower power consumption, more effectively to achieve cost reduction with smaller footprint for customers’ next high-end power management ICs.