Maintaining reliable production capacity is a key manufacturing strategy at TSMC. TSMC currently operates six 12-inch GIGAFAB^® facilities – Fab 12, Fab 14, Fab 15, Fab 18, Fab 20, and Fab 22. As of 2025, the combined capacity has exceeded 13 million 12-inch equivalent wafers, offering process technologies covering the full generation and half-generation designs from 0.13 micrometers to 2 nanometers. The GIGAFAB^® facilities are coordinated by a centralized management system known as super manufacturing platform (SMP) to provide customers with consistent quality and reliability, greater flexibility to cope with demand fluctuations, and faster yield learning and time-to-volume production, as well as better-function and lower-cost product requalification.

In 2025, TSMC expanded its advanced packaging capacity in Chiayi and Tainan, and actively commencing the construction of its 1.4-nanometer fab in Taichung. These efforts help clients accelerate innovation to meet the rapidly changing market challenges and satisfy greater demand brought by the growth of Artificial Intelligence (AI) technology.

Furthermore, to further strengthen its global service network, TSMC continues to expand its overseas production bases in Arizona, USA, and Kumamoto, Japan, and has established a new production site in Dresden, Germany. Through these global layouts, TSMC’s global operations will become more mature and robust.