Maintaining dependable capacity is a key part of TSMC’s manufacturing strategy. The Company currently operates four 12-inch GIGAFAB® facilities – Fabs 12, 14, 15 and 18. The combined capacity of the four facilities exceeded nine million 12-inch equivalent wafers in 2020. Fab 12, 14 and 15 support 0.13μm, 90nm, 65nm, 40nm, 28nm, 20nm, 16nm, 10nm, and 7nm process technologies, including each technology’s sub-nodes. 5nm is currently accelerating into mass production at Fab 18. Besides, an additional portion of the capacity is built at Fab 12 for R&D work on leading-edge manufacturing technologies, which currently supports the technology development of 3nm and 2nm nodes and beyond.

The four GIGAFAB® facilities are coordinated by a centralized fab manufacturing management system known as super manufacturing platform (SMP) to provide customers with more consistent quality and reliability, improved flexibility to cope with demand fluctuations, faster yield learning and time-to-volume production, and lower-cost product requalification.

  Mini Mega Giga
Profile Monthly 300mm capacity (pcs) ~10K ~25K >100K
Customer Values Operating cost High Medium Low
  Flexibility Limited Medium High
  Ramp-up agility Limited Medium High
  Cycle time Long Medium Short
  Delivery precision Limited Medium High