Maintaining dependable capacity is a key part of TSMC’s manufacturing strategy. The Company currently operates four 12-inch GIGAFAB^® facilities – Fabs 12, 14, 15 and 18. The combined capacity of the four facilities exceeded nine million 12-inch equivalent wafers in 2020. Fab 12, 14 and 15 support 0.13μm, 90nm, 65nm, 40nm, 28nm, 20nm, 16nm, 10nm, and 7nm process technologies, including each technology’s sub-nodes. 5nm is currently accelerating into mass production at Fab 18. Besides, an additional portion of the capacity is built at Fab 12 for R&D work on leading-edge manufacturing technologies, which currently supports the technology development of 3nm and 2nm nodes and beyond.