Maintaining reliable production capacity is TSMC’s key manufacturing strategy. The Company currently operates four 12-inch GIGAFAB® facilities – Fab 12, 14, 15 and 18. The combined capacity of the four facilities exceeded 12 million 12-inch wafers in 2023. Production within these facilities support 0.13µm, 90nm, 65nm, 40nm, 28nm, 16nm, 7nm, and 5nm process technologies, and their sub-nodes. 3nm technology has successfully entered volume production in Fab 18 with good yield in the second half of 2023. Capacity has been expanded at Fab 12 for R&D work on leading-edge manufacturing technologies and currently supports the technology development of 2nm nodes and beyond.

The GIGAFAB® facilities are coordinated by a centralized management system known as super manufacturing platform (SMP) to provide customers with consistent quality and reliability, improved flexibility to cope with demand fluctuations, faster yield learning and time-to-volume production, as well as lower-cost product requalification.

  Mini Mega Giga
Profile Monthly 300mm capacity (pcs) ~10K ~25K >100K
Customer Values Operating cost High Medium Low
  Flexibility Limited Medium High
  Ramp-up agility Limited Medium High
  Cycle time Long Medium Short
  Delivery precision Limited Medium High