To maintain its technology leadership, TSMC plans to continue investing heavily in R&D. While its A16 and A14 advanced CMOS logic nodes are progressing through the development pipeline, the Company’s exploratory R&D work is focused on nodes beyond A14, as well as on areas such as 3D transistors, new memories, and low-R interconnect. This work aims to lay a strong foundation to foster the development of innovative technology platforms in the future. TSMC 3DFabric® advanced packaging R&D is developing innovations in subsystem integration to further enhance advanced CMOS logic applications. The Company maintains an intense focus on new specialty technologies such as radio frequency (RF) and 3D intelligent sensors for edge AI and smart IoT applications. TSMC’s research continues to develop novel materials and new processes, devices and memories that may be adopted in the longer-term future of ten years and beyond. The Company also continues to collaborate with external research bodies from academia and industry consortia, aiming for early awareness and adoption of future cost-effective technologies and manufacturing solutions. With a highly competent and dedicated R&D team and an unwavering commitment to innovation, TSMC is confident in its ability to drive future business growth and profitability for years to come by delivering advanced, competitive semiconductor technologies to its customers.