TSMC maintains and strengthens its technology leadership by investing heavily in Research and Development. The Company’s 3nm and 2nm advanced CMOS logic nodes continue progressing through the development pipeline. The Company’s reinforced exploratory R&D work focuses on nodes beyond-2nm and on areas such as 3D transistors, new memories and low-R interconnect, to establish a solid foundation for future technology platforms.

TSMC’s 3DIC advanced packaging R&D is developing innovations in subsystem integration to further augment advanced CMOS logic applications. The Company has intensified its focus on new specialty technologies such as RF and 3D intelligent sensors, aiming at 5G and smart IoT applications. The corporate research function continues to focus on novel materials, processes, devices, and memories that may be adopted in eight to ten years and beyond. The Company also continues to collaborate with external research organizations including academia and industry consortia with the goal of gaining early awareness and adoption of future cost-effective technologies and manufacturing solutions.

With a highly competent and dedicated R&D team and its unwavering commitment to innovation, TSMC is confident in its ability to drive future business growth and profitability for years to come by delivering competitive semiconductor technologies to its customers.

Summary of TSMC's Major Future R&D Projects
Project Name Description
Beyond-3nm logic technology platform and applications 3D CMOS SoC technology platform
3D IC Cost-effective solution with better form factor and performance for System-in-Package (SiP)
Next-generation lithography EUV lithography and related patterning technology to extend Moore’s Law
Long-term research Specialty SoC technology (including new NVM, MEMS, RF, analog) and transistors with an 8 to 10 years horizon