Microcontrollers are used bumper-to-bumper to build safer, smarter, and greener cars. The electric electronic architecture now encompasses cross-domain integration. Artificial intelligence (AI) applications requiring high-performance, multiple CPU cores, and increased memory density is driving technology migration from 40/55nm process technologies to more advanced nodes. TSMC’s eFlash memory technology is qualified as grade 1 or higher to support these trends.

TSMC has also developed automotive-grade MRAM and RRAM technologies that support automotive applications at advanced technology nodes.