High Performance Computing Connectivity Technology

RF for connectivity
SerDes
Optical Interconnection

5G supports massive data traffic with more bandwidth and lower latency. To accommodate a diversity of 5G applications, the spectrum range varies widely, from sub-6GHz to mmWave.

RF for 5G Base Station

For faster speed cellular communication, 5G enables mmWave spectrum to accommodate wider signal bandwidth. It brings the demand of 5G mmWave base station with different technical challenges from sub-6 base station and, thus, different technology requirements. TSMC’s RF technologies supports both sub-6 and mmWave for base station applications.

Key SerDes design specs include link speed, power consumption per lane, and maximum tolerable channel loss. Continuous Time Linear Equalizer (CTLE) is a critical circuit in high-speed SerDes design and has been validated on N5 silicon to achieve 112Gbps operation. This circuit was implemented with tsmc HPC technology. The 112Gbps SerDes IPs by TSMC customers and/or 3rd party IP vendors are in production.

A TSMC special device helps to improve Unit Gain Frequency (UGF)

In today’s data centers, optical interconnection enables high speed, low power data transfer. Silicon photonics is gaining market share thanks to its high degree of integration and robust materials. Co-package optics (CPO) will prove critical for future data rates that will run at over 50-terrabytes per second (Tbs).

TSMC’s 65-nanometer Silicon Photonics process technology is in mass production. The Company is also developing a 3D stacking technology that integrates Silicon Photonics with high-performance computing to meet CPO requirements. Proprietary 3D stacked CPO supports high speed, low power data communication. TSMC has achieved 200 giga bits per second (Gbs) optical signal modulation and greater than 99% 3D stacking yield on engineering samples. The technology is expected to enter mass production during the latter half of 2025.