5G supports massive data traffic transmission with greater bandwidth and lower latency. To accommodate a diverse range of 5G applications, the spectrum spans from sub-6GHz to the mmWave range.

 

5G NR Spectrum
RF for 5G Base Station

For faster cellular communication, 5G enables the mmWave spectrum to accommodate wider signal bandwidth and utilizes the massive multiple-input multiple-output (MIMO) technique to enhance efficient sub-6GHz spectrum usage efficiency. This creates demand for both 5G mmWave base stations and sub-6GHz MIMO base stations. Each one presents a different technical challenge, requiring a different technological solution. TSMC’s RF technologies support both sub-6GHz and mmWave base station applications.

 

Key SerDes design specifications include link speed, power consumption per lane, and maximum tolerable channel loss. The continuous time linear equalizer (CTLE) is a critical circuit in high-speed SerDes design and has achieved 112Gbps operation on N5 silicon. This circuit was implemented using TSMC’s high-performance computing (HPC) technology. Customer-developed and third-party 112Gbps SerDes IP are in production.

A TSMC special device helps to improve Unit Gain Frequency (UGF)

 

Optical interconnection enables high-speed, low-power data transfer in today’s data center. Silicon photonics is gaining market share because of its high degree of integration and robust materials. Co-packaged optics (CPO) will be critical for supporting data rates of over 50 terabytes per second (Tbs).

TSMC’s 65nm silicon photonics technology is in volume production. The Company is also developing a 3D stacking technology that integrates silicon photonics with high-performance computing (HPC) to meet CPO requirements. This proprietary 3D stacked CPO technology supports high-speed, low-power data communication. TSMC has achieved 200 gigabits per second (Gbs) optical signal modulation and greater than 99% 3D stacking yield on engineering samples.

CPO
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