High-performance computing (HPC) enables cloud-to-edge artificial intelligence (AI) applications. The AI revolution is fueling demand for advanced computing power. TSMC's Integrated HPC Platform for AI merges state-of-the-art logic, high-performance memory, silicon photonics, and TSMC 3DFabric® to unleash the full potential of AI.
Leading-edge process technologies now require heterogenous integration with advanced packaging technologies. TSMC’s comprehensive wafer-level system integration technologies add new dimensions beyond traditional scaling. Furthermore a broad IP ecosystem, nurtured through years of TSMC and third-party investment, provides first-time-right design and fast time-to-market.
TSMC’s Integrated High-Performance Computing Platform includes:
- Leading-edge process technologies
- Connectivity technologies (SerDes, optical interconnect and RF technology)
- TSMC 3DFabric® (3D Silicon Stacking and Advanced Packaging Platform)
- A comprehensive IP ecosystem
