未來研發計劃

To maintain and strengthen TSMC's technology leadership, the Company plans to continue investing heavily in R&D. For advanced CMOS logic, the Company's 5nm and 3nm CMOS nodes continue progressing in the pipeline. In addition, the Company's reinforced exploratory R&D work is focused on beyond-3nm node; in areas such as 3D transistors, new memory, and low-R interconnect, on track to establish a solid foundation to feed into technology platforms. For 3D IC advanced packaging, innovations for energy-efficient sub-system integration and scaling provide further augmentation to CMOS logic applications. For specialty technologies, the Company has intensified its focus on new specialty technologies such as RF and 3D intelligent sensors targeting 5G and smart IoT applications. The Corporate Research function established in 2017 continues to focus on novel materials, process, devices, nanowires, memories, etc. for the long-term, beyond 8 to 10 years. The Company also continues to collaborate with external research bodies from academia to industry consortia alike with the goal of extending Moore's Law and paving the road to future cost-effective technologies and manufacturing solutions for its customers.

With a highly competent and dedicated R&D team and its unwavering commitment to innovation, TSMC is confident in its ability to deliver the best and most cost-effective SoC technologies to its customers and to drive future business growth and profitability for years to come.