(System on Integrated Chips)
|Wafer on Wafer|
|Stacking Approach||Chip on Wafer (CoW)||Wafer on Wafer (WoW)|
|Stacking Scheme||Face-to-Face, Face-to-Back|
|Testing before Stacking||Yes||No|
|Multiple Dice in a Stacking Layer||Yes||No|
|Suitable||All Technologies||Mature Technologies
(High yielding; Same die size)
Ideal for high-end, demanding cloud, data center and server applications, CoWoS is a proprietary high-yield, chip-first on interposer process that results in consistently higher assembly yield across many customized multi-chip floor plans. It has been in volume production since 2013 and has been utilized by more than 50 products.
STandard ARchitecutres (STARs) service shortens time-to-market by reducing design effort for easy product tape-out. CoWoS continues to expand its portfolio with increasing silicon interposer sizes to accommodate more advanced nodes and High Bandwidth Memory (HBMs) for higher compute power and bandwidth. With Deep Trench Capacitors (DTCs) integrated within the silicon interposer, the power integrity of CoWoS-SiP is greatly enhanced. The adoption of frontend process technologies supports increasing routing needs and enhances shielding for signal integrity.
|Substrate Size, mm||≤ 60x60||≤ 65x65||≤ 75x75|
|Interposer Size, reticles||≤ 1.75X||≤ 2X||Two ≤ 1.5X|
|Number of SoCs||1||1||> 2|
|Number of HBMs||2 and 4||6||8|
High density, fine pitch RDL interconnects are designed for high speed, high bandwidth die-to-die communication. Significant cost reduction benefit is achieved by splitting a large advanced node networking chip, such as network processor and network switch, into several small networking chips and re-integrating small network chiplets onto InFO_oS package through high density, high speed interconnects.
InFO_MS integrates advanced node SoC such as GPU, ASIC with HBM2 to support HPC applications such as low latency AI Inferencing. High density, fine pitch SERDES interconnects feature high data rate, high memory data bandwidth communication between compute die and HBM2 memory. InFO_MS offers the alternative solution to CoWoS for applications that seek cost/performance optimization in mid-to-high end HPC market.