Powerful new application processors (APs) are adopting the most advanced logic technologies to provide greater computing power for all kinds of phone apps. Many are artificial intelligence (AI) powered and have become so convenient that people cannot live without them. The AP acts as the phone’s brain and anticipates what users want to do and when they are going to do it.

This revolution will be driven by leveraging advanced sensors. Sensors act as eyes, ears, and nervous systems of phones. Sensors detect user and environmental data, such as biometrics, motion, light conditions, position, and location; and feed the data to the AP. Even simple tasks, like unlocking the phone, or snapping and sharing pictures, require sensor and AP synchronization.

TSMC provides a wide range of sensor technologies, including the most advanced 28nm (N28) stacked CMOS image sensor (CIS) and lateral overflow integration capacitor (LOFIC) pixel exhibiting a significant dynamic range improvement; customized matured nodes, such as 0.18µm CMOS-MEMS; and special modules, such as advanced image signal processor (ISP), near-infrared (NIR) enhancement, high-density capacitors, and piezoelectric transducer.

TSMC continues to develop and improve these technologies with more advanced modules and processes. The evolving sensor technology portfolio empowers more innovative products that make smartphones smarter.