InFO Technologies for 5G Mobile

Industry 1st high density 2D/3D Fan Out Wafer-Level-Packaging, InFO_PoP leverages high density RDL and fine pitch TIV technologies to integrate mobile AP into a compact 3D system for cost and performances. It features thinner profile, cooler thermal, and improved PI/SI for smartphone application since no organic substrate and C4 bumps. InFO_PoP continues to grow packaging density and performances to fulfill customer needs on 5G/AI applications.

Industry 1st high density 2D/3D Fan Out Wafer-Level-Packaging

For 5G wireless communication, InFO_AiP (InFO with antenna in Package) Integrates dipole and patch antenna with mmWave FEM chip leveraging high density RDL and fine pitch TIV. Proprietary low-Dk dielectric material and uniform RDL enable high gain and low loss. Qualified 12mm x 12mm x 0.9mm package with 2 RDLs.

CoWoS Product Tape-outs
CoWoS Product Tape-outs
Performance Gain 1X 1.15X
Thermal Resistance 1X 0.85X
Thickness 1X 0.7X
Featured Technologies
Advanced Technologies

Industry's most advanced and comprehensive technologies for mobile devices with...


Analog and RF technologies and customizations for highly differentiated products...


Higher density gate count and communication protocol change are the two main driver for...