Intelligent PMICs require higher digital content, driving Bipolar-CMOS-DMOS (BCD) into advanced technology nodes. From 130BCD to 22BCD, TSMC has increased logic gate density by more than 10 times. Meanwhile, TSMC keeps improving Ronsp performance for higher power efficiency.

40BCD and 22BCD are best suited for applications with high digital content, such as fast charger, USB interface, and audio amplifier ICs. Their logic is fully compatible with CMOS baselines, maximizing IP reuse. Additionally, these technologies integrate RRAM, providing a more cost-effective solution than eFlash for digital intelligence.

55BCD has world-leading performance for 5V LDMOS and is an appealing PMIC platform for mobile applications, such as application processors (AP).

For mainstream products, TSMC provides cost-effective 130BCD and 90BCD platforms as successors to the 8-inch 180BCD technologies. Particularly, 130BCD is auto-grade.