To better serve customers in using cloud computing resources for design, TSMC has launched the EDA on Cloud Certification Program. This initiative is designed to verify EDA tools running with TSMC design collaterals and testcases of advanced technology in the cloud. The program involves silicon-centric EDA tools including physical implementation (APR, Custom Design), timing signoff (gate-level and transistor-level STA), power signoff, electromigration and IR drop (gate-level and transistor-level EMIR), thermal analysis, physical verification (DRC, LVS, Dummy Fill, RC extraction), and circuit simulation.

In the fast-paced semiconductor industry, the design complexity is growing with the innovations on cutting-edge technologies. To address the increasing demands of EDA workload, TSMC collaborates with Cloud Alliance partners to develop a range of acceleration methodologies aiming to optimize EDA workload runtime and maximize cost efficiency in the cloud. These solutions are tailored to streamline workflows, enabling customers to leverage the flexibility, scalability, and agility of cloud computing while reducing learning curves and minimizing trial-and-error efforts.

When deploying EDA workloads to the cloud, various factors must be considered, such as selecting appropriate cloud VMs (Virtual Machines) for different workloads, and properly configuring the scheduler and storage. TSMC and Cloud Alliance partners offer application note on acceleration methodologies, which are valuable resources containing detailed methodologies, tool execution settings, and performance optimization results.

All of these application notes are available for download through TSMC Online.