InFO-PoP is the industry’s first high-density 2.5D/3D fan-out wafer-level packaging. InFO-PoP leverages high density redistribution layers (RDL) and fine pitch through InFO via (TIV)TIV technologies to integrate mobile application processors (AP) into a compact 3D system with form factor and performance benefits. It features a thinner profile, thicker silicon for better thermal performance, and improved power and signal integrity (PI/SI) while eliminating an organic substrate and C4 bumps. InFO-PoP is ideal for mobile computing applications.