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高阶主管
刘德音
董事长
学历:
美国加州大学柏克莱分校电机暨计算机信息博士
经历:
总经理暨共同执行长、营运资深副总经理、先进技术事业资深副总经理、南厂区副总经理、世大集成电路制造公司总经理
Dr. Mark Liu is currently Chairman at TSMC. Prior to assuming this post, he was President and Co-CEO from November 2013 to June 2018 and Co-Chief Operating Officer from March 2012 to November 2013. Before that, he was Senior Vice President of Operations from 2009 to 2012. From 2006 to 2009, he was a Senior Vice President responsible for the Advanced Technology Business at TSMC. He served in a number of executive positions at TSMC Fabs and the Operations organization from 2000 to 2006, and from 1999 to 2000, he was President of Worldwide Semiconductor Manufacturing Corp.

Prior to joining TSMC, from 1987 to 1993, he was with AT&T Bell Laboratory, Holmdel, NJ, as a research manager for the High Speed Electronics Research Laboratory, working on optical fiber communication systems. From 1983 to 1987, he was a process integration manager of CMOS technology development at Intel Corporation, Santa Clara, CA, developing silicon process technologies for Intel microprocessors.

Mark Liu received B.S. degree in electrical engineering from National Taiwan University. He received M.S. and Ph.D. degrees in electrical engineering and computer science from University of California, Berkeley.
魏哲家
总裁暨副董事长
学历:
美国耶鲁大学电机工程博士
经历:
总经理暨共同执行长、业务开发资深副总经理、主流技术事业资深副总经理、南厂区营运副总经理、 新加坡特许半导体公司资深副总经理
Dr. C. C. Wei joined TSMC in 1998 and currently serves as Chief Executive Officer and Vice Chairman. Prior to his recent appointment, Dr. Wei was TSMC's President and Co-CEO from November 2013 to June 2018 and Co-Chief Operating Officer from March 2012 to November 2013. From 2009 to 2012, he was TSMC’s Senior Vice President of Business Development. Before that, he was Senior Vice President of Main Stream Technology Business.

Before joining TSMC, he was Senior Vice President of Technology at Chartered Semiconductor and Senior Manager, Logic and SRAM technology development at ST Microelectronics.

C. C. Wei received B.S. degree in electrical engineering from National Chiao Tung University. And later he was awarded his PhD by Yale University.
何丽梅
财务 / 欧亚业务资深副总经理暨财务长兼发言人
学历:
国立台湾大学商学硕士
经历:
本公司财务资深副总经理暨财务长兼发言人、副总经理暨财务官兼发言人、德碁半导体公司副总经理暨财务官
Lora Ho is the Chief Financial Officer and Spokesperson of Taiwan Semiconductor Manufacturing Company Limited (TSMC).

Joined TSMC in 1999, Ms. Ho served as Corporate Controller from 1999 to 2003, and became the Chief Financial Officer since 2003. Prior to TSMC, Ms. Ho served various positions in Accounting and Finance field in Foreign invested companies.

Ms. Ho was awarded " Outstanding Financial Executive " for the year of 1993 by Financial Executives Institute, The " Best Companies' Best CFO " of Taiwan from 2007-2010 by FinanceAsia , also the Best CFO in Asia in 2011 by Institutional Investor.

Ms. Ho received her MBA degree from National Taiwan University in 2003 and a B.A. degree from National Cheng-chi University in 1978.
罗唯仁
研究发展 / 技术发展资深副总经理
学历:
美国加州大学柏克莱分校固态物理及表面化学博士
经历:
本公司营运 / 制造技术副总经理、先进技术事业副总经理、研究发展副总经理、营运组织二副总经理、美商英特尔公司CTM厂长暨先进技术发展协理
Dr. Lo is TSMC's Senior Vice President of Research and Development. Prior to this post, he served as Vice President of the Company's Advanced Technology Business.

Dr. Lo joined TSMC in 2004 as Vice President of Operations II and served as Vice President of Research & Development from 2006 to 2009.

Prior to joining TSMC, Dr. Lo was Director of Technology Development and Plant Manager with Intel Corporation's Technology and Manufacturing Group. From 1997 to 2000, he served a Factory Manager, responsible for running Intel's development factory in Santa Clara, California.

Dr. Lo has also worked at U.S. university, the Motorola Research and Development Lab and the Xerox Microelectronics Center.

Dr. Lo received his B.S. degree in physics from National Taiwan University and his M.S. and Ph.D. degrees in Solid State Physics and Surface Chemistry from University of California, Berkeley.
Rick Cassidy
企业策略办公室资深副总经理
学历:
美国西点军校工程学位
经历:
本公司资深副总经理暨北美子公司执行官、台积电北美子公司客户管理副总经理
Mr. Cassidy’s electronics career began at Fairchild Semiconductor, later acquired by National Semiconductor. Over an 18-year span he rose through manufacturing, engineering, quality and reliability, and marketing, culminating with his appointment as Vice President and General Manager of National’s Military & Aerospace Division and Co-Chair of National’s General Manager Council.

He joined TSMC North America in 1997 as Vice President of Account Management; promoted to President, TSMC North America in 2005; elected Corporate Vice President, TSMC, Ltd. in 2008; and elected Senior Vice President, TSMC, Ltd. in 2014. Over nearly two decades at TSMC he has helped lead the company to record growth, while contributing greatly to the success of the fabless semiconductor business model. He currently serves on the Global Semiconductor Alliance (GSA) Board of Directors, an organization dedicated to the advancement of the worldwide semiconductor industry.

Prior to entering the semiconductor industry, Mr. Cassidy served as an officer in the U.S. Army. He holds a Bachelor of Science degree in Engineering from the United States Military Academy at West Point.
秦永沛
营运 / 产品发展资深副总经理
学历:
国立成功大学电机工程硕士
经历:
本公司生产组织/ 产品发展副总经理
Mr. Y.P. Chin was promoted to Sr. Vice President in November 2016. Prior to this post, Mr. Chin served as TSMC's Vice President of Operations for Product Development. Prior to this, he was Vice President of Advanced Technology Business in TSMC, sharing responsibility with Senior Vice President Dr. Mark Liu for TSMC's advanced technology and 300mm fab operations.

Mr. Chin joined TSMC when it was founded in 1987 and has made significant contribution to TSMC's product engineering capability throughout his career. He was Director of Fab 1 from 1997 to 1998, and in later positions helped manage yield improvement in all new generations of advanced technology, including 0.13-micron, 90nm, 65nm, and 45nm nodes. Mr. Chin pioneered the development of TSMC's Golden Spice Modeling methodology and Design For Manufacturing program.

Prior to joining TSMC, Mr. Chin worked as an engineer with the Industrial Technology Research Institute's Electronics Research and Service Organization (ERSO-ITRI).

Mr. Chin earned his B.S. and M.S. degrees in Electrical Engineering from National Cheng Kung University.
米玉杰
研究发展 / 技术发展资深副总经理
学历:
美国洛杉矶加州州立大学电机工程博士
经历:
本公司研究开发组织 / 技术发展副总经理
Dr. Y.J. Mii was promoted to Sr. Vice President in November 2016. Prior to this post, Dr. Y.J. Mii served as TSMC's Vice President of Research and Development (R&D) since 2011. He joined TSMC in 1994 and has been involved continuously in the development and manufacturing of advanced CMOS technologies in both Fab Operation and R&D. Dr. Mii joined R&D in 2001, managing both 90nm and 40nm technology development. Following that he began supervising 28nm technology development, accelerating it to lead the foundry industry.

Dr. Mii was a research staff member at IBM Research before joining TSMC. He joined TSMC as a deputy manager of Fab 3 engineering, eventually rising to senior director of R&D before being promoted.

He holds a B.S. in electrical engineering from National Taiwan University, as well as an M.S. and Ph.D. in Electrical Engineering from the University of California, Los Angeles (UCLA).
林锦坤
资讯技术及资材暨风险管理资深副总经理
学历:
国立彰化师范大学工业教育与技术学系学士
经历:
本公司六吋暨八吋厂及制造技术中心副总经理、六吋及八吋厂总厂长、先进技术事业总厂长、十二厂/六厂资深厂长、七厂/四厂/三厂厂长、300mm项目处长
J.K. Linwas promoted to Sr. Vice President in November 2018. Prior to this post, Mr. Lin served as TSMC's Vice President of Information Technology and Materials Management & Risk Management. Prior to this, Mr. Lin served as Vice President of Mainstream Fabs and Manufacturing Technology Center.

J.K. Lin joined TSMC when it was founded in 1987 and held a number of manufacturing positions including Equipment Engineer, Section Manager, and Department Manager in Fab1 and 2. He was responsible for the construction of Fab 3 was later Fab Director of Fab 3, Fab 4, Fab7 and Senior Director for Fab 6, Fab 12, 300mm Fabs, Mainstream Fabs.Prior to joining TSMC, Mr. Lin worked in the Electronic Research & Service Organization (ERSO) of Taiwan's Industrial Technology Research Institute (ITRI).

J.K. Lin earned his B.S. degree from National Changhua University of Education.
王建光
营运 / 晶圆厂营运资深副总经理
学历:
国立成功大学化学工程硕士
经历:
本公司十二吋厂副总经理、十二吋厂总厂长、成熟技术事业总厂长、十四厂资深厂长、三厂 / 四厂厂长
J.K. Wang was promoted to Sr. Vice President in November 2018. Prior to this post, he was the Vice President of 300mm fabs operations.

J.K. Wang has served at TSMC since the company was founded in 1987. During his career with TSMC, he has been involved in many different aspects of the company's operations, including module engineering, process integration, R&D technology development, manufacturing, and fab management. Previously, he had been the Fab Director of Fab 3 / Fab 4, and Senior Director for Fab14, mainstream & 300mm Fabs. Mr. Wang has been deeply involved in building up TSMC's manufacturing technology and systems, particularly the fab automation and manufacturing infrastructure.

J.K. Wang received his B.S. and M.S. degrees in chemical engineering from National Cheng-Kung University in 1981 and 1983 respectively.
蔡能贤
品质暨可靠性副总经理
学历:
美国麻省理工学院材料工程博士
经历:
本公司品质暨可靠性处资深处长
Dr. N.S. Tsai, TSMC Vice President of Quality and Reliability, joined the company in 1989. As head of Quality and Reliability since 2004, Dr. Tsai has led the successful customer qualification of 90nm, 80nm, and 65nm technologies.

Over his career at TSMC, Dr. Tsai has a wide variety of positions in R&D, Operations, and Assembly & Testing. He was director of Fab 1 from 1993 to 1995, and served as director of Fab 4 from 1995 to 1997, where he established standard quality systems that made Fab 4 an outstanding manufacturing facility as well as TSMC's R&D development fab for several technology generations.

Dr. Tsai also established TSMC's first 12-inch pilot line and was responsible for evaluating and selecting production tools, developing automated manufacturing systems, and transitioning from eight-inch to 12-inch production. He also developed TSMC's flip chip technology and established TSMC's first 12-inch wafer bumping line when he was the head of Assembly & Test.

Before joining TSMC, Dr. Tsai served with AT&T's R&D department for 5 years.

Dr. Tsai earned his B.S. in Physics from National Tsinghua University, his M.S. degree in Physics from Temple University and his Ph.D. in Materials Science from Massachusetts Institute of Technology.
孙中平
企业规划组织副总经理
学历:
美国康乃尔大学材料科学暨工程博士
经历:
本公司企业规划组织协理、美商国际商用机器公司(IBM)科技事业群台湾总经理
Dr. Irene Sun is currently TSMC's Vice President Corporate Planning. Prior to this post, she was Senior Director of the Corporate Planning Organization. She joined TSMC in October 2003 as Director of the Corporate Pricing Division.

Prior to TSMC, Dr. Sun worked at IBM for 23 years and held a variety of management positions in R&D, Manufacturing Engineering, Marketing & Sales, and Business Management.

Dr. Sun received her B.S. degree in Nuclear Engineering from National Tsinghua University in Taiwan, and her Ph.D. in Materials Science and Engineering from Cornell University.
侯永清
研究发展 / 技术发展副总经理
学历:
美国纽约雪城大学电机博士
经历:
本公司设计暨技术平台组织资深处长、工研院电通所前端设计流程研发
Dr. Cliff Hou was appointed TSMC's Vice President of Research and Development (R&D) in August, 2018. Prior to this post, Dr. Hou served as TSMC’s Vice President at Design and Technology Platform from August, 2011 to July, 2018. He joined TSMC in 1997 and has made profound contribution to TSMC's design technology and ecosystem development.

Over the last decade at TSMC, Dr. Hou helped the company establish TSMC’s Open Innovation Platform® (OIP), which has become one of the most powerful design ecosystems in the global semiconductor industry. From 1997 to 2007, Dr. Hou established the company's technology design kit and reference flow development organizations.

Prior to joining TSMC, Dr. Hou was a section manager specializing in physical verification methodologies at the Computer & Communications Research Laboratories, Industrial Technology Research Institute (ITRI/CCL) in Taiwan; and served as an Associate Professor at Kaohsiung Polytechnic Institute, Taiwan.

Dr. Hou received National Manager Excellence Award in 2010. He led the company's Open Innovation Platform project team to win First National Industry Innovation Award in 2011 by the Ministry of Economic Affairs (MOEA), Taiwan.

Dr. Hou holds 46 U.S. Patents and serves as a member of Board of Directors in Global Unichip Corp. He received his B.S. degree in Control Engineering from Taiwan's National Chiao-Tung University, and his Ph.D. in Electrical and Computer Engineering from Syracuse University.
方淑华
法务副总经理暨法务长
学历:
爱荷华大学比较法学硕士
经历:
本公司副法务长、公司法务处处长、台湾国际专利法律事务所 资深律师
Sylvia Fang was appointed Vice President and General Counsel for TSMC in August, 2014. Previously, she served as Associate General Counsel, heading that organization since February, 2014. Sylvia joined TSMC in 1995. She was previously Director at Corporate Legal Division where she worked on numerous high-profile corporate transactions, precedent-setting intellectual property trade secret litigations, the promotion of significant legal changes and the resolution of corporate governance issues. She also has been working extensively with the Board of Directors, including the independent directors on various Board, Audit Committee and Compensation Committee matters and other special projects.

Prior to her career at TSMC, Sylvia worked at a leading boutique intellectual property law firm (TIPLO) where she developed her expertise on general corporate and IP issues.

The global legal community recognized Sylvia’s achievement in 2005 when the leading publication Asialaw magazine awarded her the “2005 Deep & Far Award for Taiwan In-House Counsel”. She is also known among key government trade, commerce and securities law administrative agencies due to her relations cultivated over the years of promoting important legal changes to support corporate goals.

Sylvia is an attorney admitted in Taiwan having received her LL.B. degree from National Taiwan University, and her M.C.L. from School of Law, University of Iowa.
马慧凡
人力资源副总经理
学历:
国立台湾大学国际企业管理硕士
经历:
本公司人力资源组织长 、 趋势科技人力资源资深副总经理
Connie Ma has been appointed as Vice President of Human Resources since August 2014.  She joined TSMC in June 2014 as Director of Human Resources.

Connie has over 30 years of HR experience.  Prior to joining TSMC, she held several senior HR managerial positions at Trend Micro Inc., NCR Corporation and AT&T Corporation.  Connie was Senior Vice President of Global Human Resources at Trend Micro where she led corporate transformation by building a global HR team to enhance the execution of corporate strategy and culture in terms of realigning organization structure, strengthening global collaboration and facilitating employee engagement.

Connie holds an EMBA from National Taiwan University and a bachelor's degree in business administration from Soochow University.
王英郎
营运 / 晶圆厂营运副总经理
学历:
国立交通大学电子工程博士
经历:
南科十四B厂资深厂长
Dr. YL Wang was appointed TSMC's Vice President of Technology Development (TD) in October 2015. Prior to this post, Dr. Wang served as Senior Director of Fab 14B.

Dr. Wang joined TSMC in 1992 and has been deeply involved in building TSMC’s manufacturing technology and methodology. During his 20+ years career, he successfully contributed to mass-production of the company's 0.35-micorn, 0.25-micorn, 0.18-micorn, 0.13-micorn, 90nm, 65nm, 40nm, 20nm and 16nm process technologies, providing significant productivity improvement and defect density enhancement.

Dr. Wang received his B.S. degree in Physics from National Tsing Hua University; his M.S. degree in Materials Science from National Sun Yat-Sen University and Ph.D. in Electrical Engineering and Computer Science from the National Chiao Tung University. He has 109 US patents, and over 100 Republic of China, Peoples Republic of China ,and French patents.
余振华
研究发展 / Integrated Interconnect & Packaging副总经理
学历:
美国乔治亚理工学院材料工程博士
经历:
本公司研究开发组织 Integrated Interconnect & Packaging 处资深处长
Dr. Doug Yu was appointed TSMC's Vice President in November 2016. Dr. Yu joined TSMC in 1994. He was previously Senior Director of the Integrated Interconnect & Packaging Division, where he led the development of interconnect technology for integrated circuits.

Dr. Yu received his B.S. degree in Physics and M.S. degree in Materials Science and Engineering both from National Tsing Hua University, and his Ph.D. in Materials Engineering from Georgia Institute of Technology. In 2013, he was elevated to IEEE fellow grade.
Alexander Kalnitsky
台积科技院士、营运 / 产品发展 / 特殊技术副总经理
学历:
加拿大卡尔顿大学电机工程博士
经历:
本公司研究开发组织特殊技术处资深处长
Dr. Alexander Kalnitsky was appointed TSMC's Vice President in November 2016. Prior to this appointment, Dr. Kalnitsky served as a Senior Director of the More-than-Moore Technologies Division.

Dr. Kalnitsky joined TSMC in 2009. At TSMC, he is a well-respected technical leader with an excellent track record in HV/Power/Analog/RF/CIS/MEMS processes development. He was elected a TSMC Fellow in 2013.

Prior to joining TSMC, Dr. Kalnitsky worked for over 30 years in the semiconductor industry at companies such as Intersil, Maxim Integrated Product, National Semiconductor, STMicroelectronics and Northern Telecom

Dr. Kalnitsky received his M.S. degree in Applied Sciences from the University of Toronto, Canada and Ph.D. in Electrical Engineering from Carleton University, Canada. He authored or co-authored over 140 issued U.S. patents (over 20 invention disclosures filed while at TSMC). Alex has over 120 publications in technical journals and conference presentations.
张晓强
业务开发副总经理
学历:
美国杜克大学电机工程博士
经历:
本公司研究发展 / 设计暨技术平台副总经理 、美商英特尔公司技术与制造副总经理
Dr. Kevin Zhang currently serves as Vice President of Business Development. Prior to this role, Dr. Zhang served as Vice President of Design and Technology Platform. Before joining TSMC in November 2016, Dr. Zhang was Vice President of Technology and Manufacturing Group and Director of Circuit Technology at Intel, where he was responsible to the development of process design rules, circuit & device modeling, digital libraries, key analog and mixed-signal circuits. He led the development of embedded memory technologies from 90nm to 10nm at Intel. He was also responsible to the design and validation of lead vehicles for process technology development at Intel. Dr. Zhang was elected as Intel Fellow in 2005 and led his teams to win 5 Intel Achievement Awards, the highest technical accomplishments at the company.

Dr. Zhang has published more than 80 papers at international conferences and in technical journals and is the editor of Embedded Memory for Nano-Scale VLSIs, published by Springer in 2009. He holds 55 U.S. patents in the field of integrated circuit technology. Dr. Zhang was the 2016 International Solid-State Circuit Conference (ISSCC) Program chair and serves on IEEE VLSI Executive Committee. He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE). He received his bachelor's degree from Tsinghua University in Beijing and his Ph.D. from Duke University, both in electrical engineering.
张宗生
台积科技院士、营运 / 产品发展副总经理
学历:
国立清华大学电机工程博士
经历:
本公司营运组织十二B厂资深厂长
Dr. T.S. Chang was appointed TSMC’s Vice President in February 2018. Dr. Chang joined TSMC in 1995 and was previously Operations Organization’s Senior Director of Fab12B. Since joining TSMC, Dr. Chang has participated in the development of Fab 1, Fab 4, Fab 8, Fab 12 and Fab 14, having more than 24 years of practical experience in Operations Organization. Dr. Chang is a key person to implement TSMC’s leading edge technology into manufacturing.

Dr. Chang received his B.S. degree in Electrical Engineering; M.S. degree in Electrical Engineering and Ph.D. in Electrical Engineering all from National Tsing Hua University.
吴显扬
研究发展 / 技术发展 / 3奈米平台研发处副总经理
学历:
美国威斯康辛大学麦迪逊分校电机工程博士
经历:
本公司研究开发组织3奈米平台研发处资深处长
Dr. Michael Wu was appointed TSMC’s Vice President in February 2018. Dr. Wu joined TSMC R&D in 1996 and participated in advanced CMOS technology development from 0.13um, 90nm, 65nm, 28nm, 16nm to 7nm node in the past 20+ years. He was previously R&D Organization’s Senior Director of N3 Platform Development Division. Dr. Wu is a key person to the success of 16FF and 7nm technologies. He is responsible for 3nm technology development as well.

Dr. Wu received his B.S. degree in Electrical Engineering from National Cheng Kung University; his M.S. degree in Electrical Engineering and Ph.D. in Electrical Engineering both from University of Wisconsin-Madison. Michael also received an EMBA degree in the Institute of Technology Management from National Tsing Hua University. He is an IEEE Fellow for his leadership in CMOS process integration. He has published 45 papers and holds 55 patents in the field of semiconductor technology.
曹敏
研究发展 / 技术发展 / Pathfinding副总经理
学历:
美国史丹佛大学物理博士
经历:
本公司研究开发组织Pathfinding处资深处长
Dr. Min Cao was appointed TSMC’s Vice President in February 2018. Dr. Cao joined TSMC in 2002. He has participated in successful development of multiple generations of advanced CMOS technology including N90, N65, N40, N28, N20 and N10. From 2006-2008, he led the development of N40G, the first TSMC technology node utilizing super density scaling (significantly higher than 2x). In 2009, he led the development of N28HP, the 1st TSMC node utilizing HKMG technology. He led the development of N20 from 2010 to 2013, and N10 from 2014 to 2016. Since 2016, Dr. Cao has served as a Senior Director of Path-finding Division.

Prior to joining TSMC, he worked at Hewlett-Packard Laboratories from 1994-1999, PDF Solutions from 1999-2000, and Pericom Semiconductor from 2000-2002, all in the US.

Dr. Cao holds 36 U.S. patents in the field of integrated circuit technology. He has served on many conference committees including IEDM and VLSI Symposium. Min Cao received his B.S. degree in Electronic Engineering from Fudan University in Shanghai, M.S. degree in Physics from San Francisco State University, and his Ph.D. degree in Physics from Stanford University.
黄汉森
研究发展 / 技术研究副总经理
学历:
美国理海大学电机工程博士
经历:
美国史丹佛大学电机工程讲座教授、美商IBM公司研发资深经理
Dr. H.-S. Philip Wong currently serves as Vice President of Corporate Research responsible for exploring new technologies for TSMC. Prior to joining TSMC, Dr. Wong is Professor of Electrical Engineering and holds the Willard R. and Inez Kerr Bell Professorship in the School of Engineering at Stanford University. He has 16 years of research and path-finding experience at IBM Research, where many of his early research works have led to product technologies. His research aims at translating discoveries in science into practical technologies and has contributed to advancements in nanoscale science and technology, semiconductor technology, solid-state devices, and electronic imaging. He is the founding Faculty Co-Director of the Stanford SystemX Alliance and Faculty Director of the Stanford Non-Volatile Memory Technology Research Initiative (NMTRI). He has held leadership positions at major multi-university research centers of the National Science Foundation and the Semiconductor Research Corporation.

Dr. Wong received his B.Sc. (Hons.) from the University of Hong Kong, his M.S. degree from Stony Brook University, and his Ph.D. from Lehigh University, all in electrical engineering. He has published over 600 papers at international conferences and technical journals and is the co-author of a book and 11 book chapters. He holds 52 US patents. He is an IEEE Fellow. He received the honorary doctorate degree from Institut Polytechnique de Grenoble, France. Dr. Wong and his students have won best paper awards at premier conferences such as the International Solid-State Circuits Conference (ISSCC) and Symposia on VLSI. He served as General Chair of the International Electron Devices Meeting (IEDM) and is currently the Chair of the IEEE Executive Committee of the Symposia on VLSI Technology and Circuits.
廖德堆
营运 / 产品发展 / 先进封装技术暨服务副总经理
学历:
美国德州大学阿灵顿分校材料科学博士
经历:
本公司后段技术暨服务处资深处长、新加坡特许半导体公司副总经理、应用材料公司技术经理
Dr. Marvin Liao was appointed TSMC’s Vice President in November 2018. Dr. Liao joined TSMC in 2002 and is currently Vice President of the Advanced Packaging Technology and Service. He is responsible for the management of backend business and operations, including bumping, InFO, CoWoS, Circuit testing, and turnkey services. During his career with TSMC, Dr. Liao was Technical Director of Fab 6 and Senior Director of Backend Technology.

Dr. Liao received his B.S. degree from National Tsing Hua University, his M.S. and Ph.D. degrees from the University of Texas-Arlington, in Materials Science. Prior to joining TSMC, Dr. Liao worked for over 12 years in the semiconductor industry at companies such as Chartered Semiconductor, Applied Materials and SGS Thomson Microelectronics.
廖永豪
营运 / 晶圆厂营运 / 十五B厂副总经理
学历:
国立清华大学化学工程硕士
经历:
本公司营运组织十五B厂资深厂长
Y.H. Liaw was appointed Vice President of Operations at TSMC in February 2019. Since joining TSMC in 1988, Y.H. Liaw held a wide range of manufacturing positions including thin film, etching, and lithography engineering. He has been director of Fab 5, Fab 8, and Fab 15.

As Director of Fab 15, he successfully led the volume production of 28-nanometer technology with innovations in cross-organizational collaboration including the “Central Setup Team” which helped Fab 15 break records for rapid equipment move-in, and the “Super Manufacturing Platform”, which enabled smooth technology transfer from R&D to manufacturing. For his efforts, in 2013 he received the R.O.C. National Management Excellence Award as well as the TSMC Medal of Honor.

Y.H. Liaw received his B.S. and M.S. degrees in Chemical Engineering from National Tsing Hua University.

子公司高阶主管
 
David Keller
北美子公司执行官
学历:
美国圣汤玛斯大学商学硕士
经历:
台积电北美子公司总经理、台积电北美子公司执行副总经理
 
Maria Marced
欧洲子公司总经理
学历:
西班牙马德里理工大学电信工程博士
经历:
飞利浦半导体/恩智浦半导体资深副总裁暨营销业务总经理
 
小野寺诚
日本子公司总经理
学历:
美国Willamette University企业管理硕士
经历:
台积电日本子公司副总经理
 
杜隆钦
台积电 (中国) 有限公司总经理
学历:
美国杜兰大学商学硕士
经历:
本公司人力资源副总经理
本公司企业规划组织协理
 
罗镇球
台积电南京有限公司总经理
学历:
北京大学工商管理学硕士
经历:
台积电 (中国) 有限公司副总经理
/tsmcdotcom/PRListingNewsAction.do?language=E
TSMC Reports First Quarter EPS of NT$2.37(2019/04/18)
   
TSMC Files Annual Report on Form 20-F for 2018(2019/04/17)
   
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