TSMC's Open Innovation Platform^® model brings together the creative thinking of customers and partners under the common goal of shortening: design time, time-to-volume, time-to-market and, ultimately, time-to-revenue. The model features:

• The foundry segment's earliest and most comprehensive electronic design automation (EDA) certification program, delivering timely design tool enhancements required by new process technologies.
• The foundry segment's most comprehensive silicon-proven intellectual properties (IP) and library portfolio.
• An alliance that enables semiconductor design in the cloud to achieve scalability, agility and flexibility that meets a variety of customer requirements.
• An alliance that provides design services to support customer demand for 3^rd party resources and capabilities at various points and scope, along the semiconductor design value chain.
• An alliance that helps customers integrate multiple chips and/or chiplets into 3D stacking and advanced packaging as part of a system-level designs process.
• A partner management portal through a TSMC-Online direct link that facilitates ecosystem partner communication and enhances business-side productivity.

TSMC provides a robust design ecosystem, process technologies, and manufacturing excellence that are the foundation of the IC industry and promote the greatest degree of collaboration.