Emerging AI and 5G applications such as connected devices, smart cars, virtual reality/augmented reality, and intelligent manufacturing are driving explosive data growth. The result is unprecedented demand for compute power in cloud datacenters and communication infrastructures.
Wired and wireless infrastructure devices are accelerating their migration towards leading-edge technologies in order to achieve higher performance, better power efficiency, and improved functionality – leading to better system level differentiation. In addition, high-speed interfaces are supporting faster data throughput and improved connectivity.
Given the insatiable compute demand, we see customers not only using our leading edge process technologies, but also increasingly adopting our comprehensive Wafer Level System Integration technologies, as a new axis/dimension beyond traditional Moore’s-Law scaling.
A broad IP ecosystem, nurtured through years of investment by us and by our partners, helps our customers with first-time-right design and fast time-to-market.
TSMC's High-Performance Computing Platform includes:
- Leading-edge process technologies
- Connectivity Solutions
- 3DFabric (3D Si Stacking and Advanced Packaging Platform)
- Comprehensive IP ecosystem
