In mass production, we employ an intelligent bin management system to accurately manage trillions of customer die combinations. This system fully utilizes the different grades of customer dies and produces more high-performance chiplets with consistent quality.

Committed to manufacturing excellence, TSMC has reached a new level of intelligent manufacturing by incorporating deep learning and image recognition, which are widely applied in its advanced packaging manufacturing fabs. TSMC has continuously deployed several technologies to enable “Intelligent Fab Automation,” reducing fab costs and cycle times while enhancing quality management.

“Intelligent Fab Automation” is integrated by several expert systems, including the Manufacturing Execution System (MES), Advanced Process Control (APC), and Automated Material Handling System (AMHS). In addition to automation systems, advanced packaging also leverages artificial intelligence (AI), human-in-the-loop (HITL), machine learning(ML), big data analysis, and edge computing techniques to supervise the intelligent systems that control the physical equipment.

Based on the knowledge of wafer-level Manufacturing Execution System (MES), TSMC developed the exclusive die-level MES adopted in its advanced packaging fabs, which provides instant die-level information, real-time dispatching and transfer instructions, comprehensive defect interception and classification, automated yield prediction and optimization.

As mentioned, TSMC has not only deployed APC to control and operate tools but also implemented Advanced Defect Classification (ADC) in the process flow, which automates the yield and quality defense control to intercept and classify defects. Furthermore, TSMC yield analysis engine using HITL and advanced algorithms detects defects and isolates defective material precisely.

Linking these various systems allows TSMC’s Intelligent Packaging Fab to provide intelligent routing, sequencing, precise workflow, high-quality defense, and defect prevention within the fab to speed up time-to-market and time-to-volume—the key mission TSMC is committed to achieving with its customers.