TSMC provides customers with leading, comprehensive technologies to deliver innovative smart digital TVs (DTV) and set-top boxes (STB) System on Chip (SoC) for emerging applications, e.g., SoC to integrate artificial intelligence (AI)-enabled picture quality enhancement, super resolution upscaling to 8K/4K, voice command Human Machine Interface (HMI), 120/100Hz high frame rate (HFR) for cloud gaming, etc.

TSMC’s leading 7nm/6nm FinFET compact (FFC), 16FFC/12FFC, 22nm ultra-low power (22ULP)/22nm ultra-low leakage (22ULL) and 28nm high performance mobile compact plus (28HPC+) technologies have been widely adopted by leading global makers of 8K/4K DTV, 4K streaming STB/over-the-top (OTT) dongle, digital single-lens reflex (DSLR) camera, and so on. TSMC will continue to make these technologies more cost competitive through die size shrink and to drive lower power consumption for more cost-effective packaging.

Meanwhile, TSMC works diligently to enhance its core competitiveness to support customers in creating and differentiating their innovative products in this market.

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28HPC+/22ULP

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