CoWoS® platform provides best-in-breed performance and highest integration density for high performance computing applications. This wafer level system integration platform offers wide range of interposer sizes, number of HBM cubes, and package sizes. It can enable larger than 2X-reticle size (or ~1,700mm2) interposer integrating leading SoC chips with more than four HBM2/HBM2E cubes.
The Chronicle of CoWoS
2019
- Production Milestone
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More than 60 product tape-outs are in production or in development as of Aug. 2019
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- Customer Product
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Industry 1st 7nm GPU w/ deep learning accelerator
- 1TB/s in BW
- 4 HBM2
- 1X reticle interposer
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AI training accelerator w/ 1.2TB/s in BW
- N16+
- 4 HBM2
- 1.5X reticle interposer
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2018
- Customer Product
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Fujitsu A64FXLEARN MORE
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Build your 56G Enterprise Networking ASICs with MediaTekLEARN MORE
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2017
- Customer Product
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Broadcom Announces Industry's First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking ApplicationsLEARN MORE
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NEC "Aurora" Vector Engine vector processorLEARN MORE
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Nvidia TESLA GV100LEARN MORE
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- Industry Publication
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IEEE Transaction on electronics devices 2017Wafer-Level Integration of an Advanced Logic-Memory System Through the Second-Generation CoWoS TechnologyLEARN MORE
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2016
- Customer Product
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Nvidia TESLA GP100LEARN MORE
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Industry's first ASIC based AI accelerator from learning only to learning+inference
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- Industry Publication
2015
- Customer Product
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Xilinx XCVU440LEARN MORE
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2014
- Customer Product
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HiSilicon Hi1616LEARN MORE
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- Industry Publication
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IEDM 2014A manufacturable interposer MIM decoupling capacitor with robust thin high-K dielectric for heterogeneous 3D IC CoWoS wafer level system integrationLEARN MORE
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2013
- Industry Publication
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VLSI 2013Manufacturability Optimization and Design Validation Studies for FPGA-Based, 3D Integrated CircuitsLEARN MORE
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IITC 2013Innovative Wafer-based Interconnect Enabling System Integration and Semiconductor Paradigm ShiftsLEARN MORE
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2012
- Customer Product
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Xilinx 7V2000T/7V580TLEARN MORE
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- Industry Publication
2011
- Industry Publication
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ECTC 2011Advanced Reliability Study of TSV Interposers and Interconnects for the 28nm Technology FPGALEARN MORE
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